- 制造厂商:TI
- 产品类别:开关与多路复用器
- 技术类目:模拟开关和多路复用器
- 功能描述:具有预充电输出和 –2V 下冲保护的 5V、1:1 (SPST)、8 通道 FET 总线开关
- 点击这里打开及下载SN74CBT6845C的技术文档资料
- TI代理渠道,提供当日发货、严格的质量标准,满足您的目标价格
The SN74CBT6845C is a high-speed TTL-compatible FET bus switch with low ON-state resistance (ron), allowing for minimal propagation delay. Active Undershoot-Protection Circuitry on the A and B ports of the SN74CBT6845C provides protection for undershoot up to 2 V by sensing an undershoot event and ensuring that the switch remains in the proper OFF state. The device also precharges the B port to a user-selectable bias voltage (BIASV) to minimize live-insertion noise.
The SN74CBT6845C is an 8-bit bus switch with a single output-enable (OE\) input. When OE\ is low, the 8-bit bus switch is ON, and the A port is connected to the B port, allowing bidirectional data flow between ports. When OE\ is high, the 8-bit bus switch is OFF, and a high-impedance state exists between the A and B ports. The B port is precharged to BIASV through the equivalent of a 10-k resistor when OE\ is high, or if the device is powered down (VCC = 0 V).
During insertion (or removal) of a card into (or from) an active bus, the cards output voltage may be close to GND. When the connector pins make contact, the cards parasitic capacitance tries to force the bus signal to GND, creating a possible glitch on the active bus. This glitching effect can be reduced by using a bus switch with precharged bias voltage (BIASV) of the bus switch equal to the input threshold voltage level of the receivers on the active bus. This method will ensure that any glitch produced by insertion (or removal) of the card will not cross the input threshold region of the receivers on the active bus, minimizing the effects of live-insertion noise.
This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off.
To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
- Undershoot Protection for Off-Isolation on A and B Ports Up To –2 V
- B-Port Outputs Are Precharged by Bias Voltage (BIASV) to Minimize Signal Distortion During Live Insertion and Hot-Plugging
- Supports PCI Hot Plug
- Bidirectional Data Flow, With Near-Zero Propagation Delay
- Low ON-State Resistance (ron) Characteristics (ron = 3 Typical)
- Low Input/Output Capacitance Minimizes Loading and Signal Distortion (Cio(OFF) = 5.5 pF Typical)
- Data and Control Inputs Provide Undershoot Clamp Diodes
- Low Power Consumption (ICC = 3 μA Max)
- VCC Operating Range From 4 V to 5.5 V
- Data I/Os Support 0 to 5-V Signaling Levels (0.8-V, 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, 5-V)
- Control Inputs Can be Driven by TTL or 5-V/3.3-V CMOS Outputs
- Ioff Supports Partial-Power-Down Mode Operation
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model (A114-B, Class II)
- 1000-V Charged-Device Model (C101)
- Supports Both Digital and Analog Applications: PCI Interface, Memory Interleaving, Bus Isolation, Low-Distortion Signal Gating
- Configuration
- 1:1 SPST
- Number of channels (#)
- 8
- Power supply voltage - single (V)
- 5
- Protocols
- Analog
- Ron (Typ) (Ohms)
- 3
- CON (Typ) (pF)
- 13.5
- Bandwidth (MHz)
- 200
- Operating temperature range (C)
- -40 to 85
- Features
- Undershoot protection
- Input/output continuous current (Max) (mA)
- 128
- Rating
- Catalog
SN74CBT6845C的完整型号有:SN74CBT6845CPW、SN74CBT6845CPWR、SN74CBT6845CRGYR,以下是这些产品的关键参数及官网采购报价:
SN74CBT6845CPW,工作温度:-40 to 85,封装:TSSOP (PW)-20,包装数量MPQ:70个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74CBT6845CPW的批量USD价格:.367(1000+)
SN74CBT6845CPWR,工作温度:-40 to 85,封装:TSSOP (PW)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74CBT6845CPWR的批量USD价格:.167(1000+)
SN74CBT6845CRGYR,工作温度:-40 to 85,封装:VQFN (RGY)-20,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-2-260C-1 YEAR,引脚镀层/焊球材料:NIPDAU,TI官网SN74CBT6845CRGYR的批量USD价格:.167(1000+)
LEADED-ADAPTER1 — 用于快速测试 TI 5、8、10、16 和 24 引脚引线式封装的表面贴装转 DIP 接头适配器
EVM-LEADED1 板可对 TI 的常见引线式封装进行快速测试和电路板试验。该评估板具有足够的空间,可将 TI 的 D、DBQ、DCT、DCU、DDF、DGS、DGV 和 PW 表面贴装封装转换为 100mil DIP 接头。