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- 制造厂商:TI
- 产品类别:开关与多路复用器
- 技术类目:模拟开关和多路复用器
- 功能描述:具有电平转换功能的 5V、1:1 (SPST)、10 通道通用 FET 总线开关
- 点击这里打开及下载SN74CBTD3861的技术文档资料
- TI代理渠道,提供当日发货、严格的质量标准,满足您的目标价格
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The SN74CBTD3861 provides ten bits of high-speed TTL-compatible bus switching. The low on-state resistance of the switch allows connections to be made with minimal propagation delay. A diode to VCC is integrated on the die to allow for level shifting from 5-V signals at the device inputs to 3.3-V signals at the device outputs.
The device is organized as one 10-bit switch with a single output-enable (OE)\ input. When (OE)\ is low, the switch is on, and port A is connected to port B. When (OE)\ is high, the switch is open, and the high-impedance state exists between the two ports.
- 5- Switch Connection Between Two Ports
- TTL-Compatible Input Levels
- Designed to Be Used in Level-Shifting Applications
- Configuration
- 1:1 SPST
- Number of channels (#)
- 10
- Power supply voltage - single (V)
- 5
- Protocols
- Analog
- Ron (Typ) (Ohms)
- 5
- ON-state leakage current (Max) (μA)
- 1
- Bandwidth (MHz)
- 20
- Operating temperature range (C)
- -40 to 85
- Features
- Signal path translation
- Input/output continuous current (Max) (mA)
- 128
- Rating
- Catalog
SN74CBTD3861的完整型号有:SN74CBTD3861DBQR、SN74CBTD3861DBR、SN74CBTD3861DGVR、SN74CBTD3861DW、SN74CBTD3861DWR、SN74CBTD3861PW、SN74CBTD3861PWR,以下是这些产品的关键参数及官网采购报价:
SN74CBTD3861DBQR,工作温度:-40 to 85,封装:SSOP (DBQ)-24,包装数量MPQ:2500个,MSL 等级/回流焊峰值温度:Level-2-260C-1 YEAR,引脚镀层/焊球材料:NIPDAU,TI官网SN74CBTD3861DBQR的批量USD价格:.165(1000+)
SN74CBTD3861DBR,工作温度:-40 to 85,封装:SSOP (DB)-24,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74CBTD3861DBR的批量USD价格:.216(1000+)
SN74CBTD3861DGVR,工作温度:-40 to 85,封装:TVSOP (DGV)-24,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74CBTD3861DGVR的批量USD价格:.216(1000+)
SN74CBTD3861DW,工作温度:-40 to 85,封装:SOIC (DW)-24,包装数量MPQ:25个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74CBTD3861DW的批量USD价格:.259(1000+)
SN74CBTD3861DWR,工作温度:-40 to 85,封装:SOIC (DW)-24,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74CBTD3861DWR的批量USD价格:.216(1000+)
SN74CBTD3861PW,工作温度:-40 to 85,封装:TSSOP (PW)-24,包装数量MPQ:60个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74CBTD3861PW的批量USD价格:.259(1000+)
SN74CBTD3861PWR,工作温度:-40 to 85,封装:TSSOP (PW)-24,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74CBTD3861PWR的批量USD价格:.159(1000+)
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LEADED-ADAPTER1 — 用于快速测试 TI 5、8、10、16 和 24 引脚引线式封装的表面贴装转 DIP 接头适配器
EVM-LEADED1 板可对 TI 的常见引线式封装进行快速测试和电路板试验。该评估板具有足够的空间,可将 TI 的 D、DBQ、DCT、DCU、DDF、DGS、DGV 和 PW 表面贴装封装转换为 100mil DIP 接头。
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