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SN74CBTLV3125的基本参数
  • 制造厂商:TI
  • 产品类别:开关与多路复用器
  • 技术类目:模拟开关和多路复用器
  • 功能描述:具有断电保护功能的 3.3V、1:1 (SPST)、4 通道 FET 总线开关
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SN74CBTLV3125的产品详情:

The SN74CBTLV3125 quadruple FET bus switch features independent line switches. Each switch is disabled when the associated output-enable (OE\) input is high.

This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

SN74CBTLV3125的优势和特性:
  • Standard ’125-Type Pinout
  • 5- Switch Connection Between Two Ports
  • Rail-to-Rail Switching on Data I/O Ports
  • Ioff Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II

SN74CBTLV3125的参数(英文):
  • Configuration
  • 1:1 SPST
  • Number of channels (#)
  • 4
  • Power supply voltage - single (V)
  • 2.5, 3.3
  • Protocols
  • Analog, JTAG, UART, I2C, SPI, RGMII, TDM, I2S
  • Ron (Typ) (Ohms)
  • 5
  • ON-state leakage current (Max) (μA)
  • 1
  • Bandwidth (MHz)
  • 200
  • Operating temperature range (C)
  • -40 to 85
  • Input/output continuous current (Max) (mA)
  • 128
  • Rating
  • Catalog
SN74CBTLV3125具体的完整产品型号参数及价格(美元):

SN74CBTLV3125的完整型号有:SN74CBTLV3125D、SN74CBTLV3125DBQR、SN74CBTLV3125DGVR、SN74CBTLV3125DR、SN74CBTLV3125PW、SN74CBTLV3125PWR、SN74CBTLV3125RGYR,以下是这些产品的关键参数及官网采购报价:

SN74CBTLV3125D,工作温度:-40 to 85,封装:SOIC (D)-14,包装数量MPQ:50个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74CBTLV3125D的批量USD价格:.392(1000+)

SN74CBTLV3125DBQR,工作温度:-40 to 85,封装:SSOP (DBQ)-16,包装数量MPQ:2500个,MSL 等级/回流焊峰值温度:Level-2-260C-1 YEAR,引脚镀层/焊球材料:NIPDAU,TI官网SN74CBTLV3125DBQR的批量USD价格:.192(1000+)

SN74CBTLV3125DGVR,工作温度:-40 to 85,封装:TVSOP (DGV)-14,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74CBTLV3125DGVR的批量USD价格:.192(1000+)

SN74CBTLV3125DR,工作温度:-40 to 85,封装:SOIC (D)-14,包装数量MPQ:2500个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74CBTLV3125DR的批量USD价格:.192(1000+)

SN74CBTLV3125PW,工作温度:-40 to 85,封装:TSSOP (PW)-14,包装数量MPQ:90个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74CBTLV3125PW的批量USD价格:.392(1000+)

SN74CBTLV3125PWR,工作温度:-40 to 85,封装:TSSOP (PW)-14,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74CBTLV3125PWR的批量USD价格:.157(1000+)

SN74CBTLV3125RGYR,工作温度:-40 to 85,封装:VQFN (RGY)-14,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-2-260C-1 YEAR,引脚镀层/焊球材料:NIPDAU,TI官网SN74CBTLV3125RGYR的批量USD价格:.192(1000+)

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SN74CBTLV3125的评估套件:

LEADED-ADAPTER1 — 用于快速测试 TI 5、8、10、16 和 24 引脚引线式封装的表面贴装转 DIP 接头适配器

EVM-LEADED1 板可对 TI 的常见引线式封装进行快速测试和电路板试验。该评估板具有足够的空间,可将 TI 的 D、DBQ、DCT、DCU、DDF、DGS、DGV 和 PW 表面贴装封装转换为 100mil DIP 接头。

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