- 制造厂商：TI
- 产品类别：开关与多路复用器
- 技术类目：模拟开关和多路复用器
- 功能描述：具有 1 个控制输入的 3.3V、1:1 (SPST)、10 通道通用 FET 总线开关
- 点击这里打开及下载SN74CBTLV3861的技术文档资料
- TI代理渠道，提供当日发货、严格的质量标准，满足您的目标价格
The SN74CBTLV3861 provides ten bits of high-speed bus switching. The low on-state resistance of the switch allows connections to be made with minimal propagation delay.
The device is organized as one 10-bit bus switch. When output enable (OE\) is low, the 10-bit bus switch is on, and port A is connected to port B. When OE\ is high, the switch is open, and the high-impedance state exists between the two ports.
This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off.
To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
- 5- Switch Connection Between Two Ports
- Rail-to-Rail Switching on Data I/O Ports
- Ioff Supports Partial-Power-Down Mode Operation
- Flow-Through Architecture Optimizes PCB Layout
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- Configuration
- 1:1 SPST
- Number of channels (#)
- 10
- Power supply voltage - single (V)
- 2.5, 3.3
- Protocols
- Analog
- Ron (Typ) (Ohms)
- 5
- ON-state leakage current (Max) (μA)
- 1
- Bandwidth (MHz)
- 200
- Operating temperature range (C)
- -40 to 85
- Features
- Powered-off protection
- Input/output continuous current (Max) (mA)
- 128
- Rating
- Catalog
SN74CBTLV3861的完整型号有：SN74CBTLV3861DBQR、SN74CBTLV3861DGVR、SN74CBTLV3861DW、SN74CBTLV3861DWR、SN74CBTLV3861NSR、SN74CBTLV3861PW、SN74CBTLV3861PWR，以下是这些产品的关键参数及官网采购报价：
SN74CBTLV3861DBQR，工作温度：-40 to 85，封装：SSOP (DBQ)-24，包装数量MPQ：2500个，MSL 等级/回流焊峰值温度：Level-2-260C-1 YEAR，引脚镀层/焊球材料：NIPDAU，TI官网SN74CBTLV3861DBQR的批量USD价格：.242（1000+）
SN74CBTLV3861DGVR，工作温度：-40 to 85，封装：TVSOP (DGV)-24，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74CBTLV3861DGVR的批量USD价格：.242（1000+）
SN74CBTLV3861DW，工作温度：-40 to 85，封装：SOIC (DW)-24，包装数量MPQ：25个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74CBTLV3861DW的批量USD价格：.315（1000+）
SN74CBTLV3861DWR，工作温度：-40 to 85，封装：SOIC (DW)-24，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74CBTLV3861DWR的批量USD价格：.266（1000+）
SN74CBTLV3861NSR，工作温度：-40 to 85，封装：SO (NS)-24，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74CBTLV3861NSR的批量USD价格：.266（1000+）
SN74CBTLV3861PW，工作温度：-40 to 85，封装：TSSOP (PW)-24，包装数量MPQ：60个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74CBTLV3861PW的批量USD价格：.3（1000+）
SN74CBTLV3861PWR，工作温度：-40 to 85，封装：TSSOP (PW)-24，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74CBTLV3861PWR的批量USD价格：.186（1000+）
LEADED-ADAPTER1 — 用于快速测试 TI 5、8、10、16 和 24 引脚引线式封装的表面贴装转 DIP 接头适配器
EVM-LEADED1 板可对 TI 的常见引线式封装进行快速测试和电路板试验。该评估板具有足够的空间，可将 TI 的 D、DBQ、DCT、DCU、DDF、DGS、DGV 和 PW 表面贴装封装转换为 100mil DIP 接头。
