These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Taken together with the ´F240 and ´F241, these devices provide the choice of selected combinations of inverting and noninverting outputs, symmetrical (active-low output-enable) inputs, and complementary OE and inputs.

The ´F244 is organized as two 4-bit buffers/line drivers with separate output enable () inputs. When is low, the device passes data from the A inputs to the Y outputs. When is high, the outputs are in the high-impedance state.

The SN74F244 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.

The SN54F244 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74F244 is characterized for operation from 0°C to 70°C.

• 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
• Package Options Include Plastic Small-Outline (SOIC) and Shrink Small-Outline (SSOP) Packages, Ceramic Chip Carriers, and Plastic and Ceramic DIPs

• Technology Family
• F
• Supply voltage (Min) (V)
• 4.5
• Supply voltage (Max) (V)
• 5.5
• Number of channels (#)
• 8
• IOL (Max) (mA)
• 64
• ICC (Max) (uA)
• 90000
• IOH (Max) (mA)
• -15
• Input type
• Bipolar
• Output type
• 3-State
• Features
• Very high speed (tpd 5-10ns), Over-voltage tolerant inputs
• Rating
• Catalog

SN74F244的完整型号有：SN74F244DB、SN74F244DBR、SN74F244DW、SN74F244DWR、SN74F244N、SN74F244NSR，以下是这些产品的关键参数及官网采购报价：

SN74F244DB，工作温度：PropertyValue，封装：SSOP (DB)-20，包装数量MPQ：70个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74F244DB的批量USD价格：.437（1000+）

SN74F244DBR，工作温度：0 to 70，封装：SSOP (DB)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74F244DBR的批量USD价格：.382（1000+）

SN74F244DW，工作温度：0 to 70，封装：SOIC (DW)-20，包装数量MPQ：25个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74F244DW的批量USD价格：.328（1000+）

SN74F244DWR，工作温度：0 to 70，封装：SOIC (DW)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74F244DWR的批量USD价格：.273（1000+）

SN74F244N，工作温度：0 to 70，封装：PDIP (N)-20，包装数量MPQ：20个，MSL 等级/回流焊峰值温度：N/A for Pkg Type，引脚镀层/焊球材料：NIPDAU，TI官网SN74F244N的批量USD价格：.314（1000+）

SN74F244NSR，工作温度：0 to 70，封装：SO (NS)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74F244NSR的批量USD价格：.273（1000+）

14-24-LOGIC-EVM — 支持 14 到 24 引脚 PW、DB、D、DW、NS、DYY 和 DGV 封装的通用逻辑 EVM

该 EVM 设计用于支持采用 14 至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。