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- 制造厂商:TI
- 产品类别:逻辑和电压转换
- 技术类目:触发器、锁存器和寄存器 - D 型锁存器
- 功能描述:八路 D 类透明锁存器
- 点击这里打开及下载SN74F373的技术文档资料
- TI代理渠道,提供当日发货、严格的质量标准,满足您的目标价格
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These 8-bit latches feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.
The eight latches of the ´F373 are transparent D-type latches. While the latch-enable (LE) input is high, the Q outputs will follow the data (D) inputs. When the latch enable is taken low, the Q outputs are latched at the logic levels set up at the D inputs.
A buffered output-enable () input can be used to place the eight outputs in either a normal
logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without need for interface or pullup components.
The output-enable () input does not affect the internal operations of the latches. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.
The SN74F373 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.
The SN54F373 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74F373 is characterized for operation from 0°C to 70°C.
- Eight Latches in a Single Package
- 3-State Bus-Driving True Outputs
- Full Parallel Access for Loading
- Buffered Control Inputs
- Package Options Include Plastic Small-Outline (SOIC) and Shrink Small-Outline (SSOP) Packages, Ceramic Chip Carriers, and Plastic and Ceramic DIPs
- Number of channels (#)
- 8
- Technology Family
- F
- Supply voltage (Min) (V)
- 4.5
- Supply voltage (Max) (V)
- 5.5
- Input type
- Bipolar
- Output type
- 3-State
- Clock Frequency (Max) (MHz)
- 70
- IOL (Max) (mA)
- 24
- IOH (Max) (mA)
- -3
- ICC (Max) (uA)
- 55000
- Features
- Very high speed (tpd 5-10ns)
SN74F373的完整型号有:SN74F373DBR、SN74F373DW、SN74F373DWR、SN74F373N、SN74F373NSR,以下是这些产品的关键参数及官网采购报价:
SN74F373DBR,工作温度:0 to 70,封装:SSOP (DB)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74F373DBR的批量USD价格:0.388(1000+)
SN74F373DW,工作温度:0 to 70,封装:SOIC (DW)-20,包装数量MPQ:25个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74F373DW的批量USD价格:0.332(1000+)
SN74F373DWR,工作温度:0 to 70,封装:SOIC (DW)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74F373DWR的批量USD价格:0.277(1000+)
SN74F373N,工作温度:0 to 70,封装:PDIP (N)-20,包装数量MPQ:20个,MSL 等级/回流焊峰值温度:N/A for Pkg Type,引脚镀层/焊球材料:NIPDAU,TI官网SN74F373N的批量USD价格:0.319(1000+)
SN74F373NSR,工作温度:0 to 70,封装:SO (NS)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74F373NSR的批量USD价格:0.277(1000+)
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14-24-LOGIC-EVM — 支持 14 到 24 引脚 PW、DB、D、DW、NS、DYY 和 DGV 封装的通用逻辑 EVM
该 EVM 设计用于支持采用 14 至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。
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