These 8-bit flip-flops feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

The eight flip-flops of the ´F374 are edge-triggered D-type flip-flops. On the positive transition of the clock (CLK) input, the Q outputs are set to the logic levels that were set up at the data (D) inputs.

A buffered output enable () input can be used to place the eight outputs in either a normal logic state (high or low) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines without need for interface or pullup components.

The output enable () input does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

The SN74F374 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.

The SN54F374 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74F374 is characterized for operation from 0°C to 70°C.

• Eight D-Type Flip-Flops in a Single Package
• 3-State Bus-Driving True Outputs
• Full Parallel Access for Loading
• Buffered Control Inputs
• Package Options Include Plastic Small-Outline (SOIC) and Shrink Small-Outline (SSOP) Packages, Ceramic Chip Carriers, and Plastic and Ceramic DIPs

• Number of channels (#)
• 8
• Technology Family
• F
• Supply voltage (Min) (V)
• 4.5
• Supply voltage (Max) (V)
• 5.5
• Input type
• Bipolar
• Output type
• 3-State
• Clock Frequency (Max) (MHz)
• 70
• IOL (Max) (mA)
• 24
• IOH (Max) (mA)
• -3
• ICC (Max) (uA)
• 86000
• Features
• Very high speed (tpd 5-10ns)

SN74F374的完整型号有：SN74F374DBR、SN74F374DW、SN74F374DWR、SN74F374N、SN74F374NSR，以下是这些产品的关键参数及官网采购报价：

SN74F374DBR，工作温度：0 to 70，封装：SSOP (DB)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74F374DBR的批量USD价格：.364（1000+）

SN74F374DW，工作温度：0 to 70，封装：SOIC (DW)-20，包装数量MPQ：25个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74F374DW的批量USD价格：.312（1000+）

SN74F374DWR，工作温度：0 to 70，封装：SOIC (DW)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74F374DWR的批量USD价格：.26（1000+）

SN74F374N，工作温度：0 to 70，封装：PDIP (N)-20，包装数量MPQ：20个，MSL 等级/回流焊峰值温度：N/A for Pkg Type，引脚镀层/焊球材料：NIPDAU，TI官网SN74F374N的批量USD价格：.299（1000+）

SN74F374NSR，工作温度：0 to 70，封装：SO (NS)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74F374NSR的批量USD价格：.26（1000+）

14-24-LOGIC-EVM — 支持 14 到 24 引脚 PW、DB、D、DW、NS、DYY 和 DGV 封装的通用逻辑 EVM

该 EVM 设计用于支持采用 14 至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。