The SN74GTLP1394 is a high-drive, 2-bit, 3-wire bus transceiver that provides LVTTL-to-GTLP and GTLP-to-LVTTL signal-level translation. It allows for transparent and inverted transparent modes of data transfer with separate LVTTL input and LVTTL output pins, which provides a feedback path for control and diagnostics monitoring. The device provides a high-speed interface between cards operating at LVTTL logic levels and a backplane operating at GTLP signal levels, and is especially designed to work with the Texas Instruments 1394 backplane physical-layer controllers. High-speed (about three times faster than standard LVTTL or TTL) backplane operation is a direct result of GTLP reduced output swing (<1 V), reduced input threshold levels, improved differential input, OEC™ circuitry, and TI-OPC™ circuitry. Improved GTLP OEC and TI-OPC circuitry minimizes bus-settling time and have been designed and tested using several backplane models. The high drive allows incident-wave switching in heavily loaded backplanes with equivalent load impedance down to 11 .

GTLP is the TI derivative of the Gunning Transceiver Logic (GTL) JEDEC standard JESD 8-3. The ac specification of the SN74GTLP1394 is given only at the preferred higher noise margin GTLP, but the user has the flexibility of using this device at either GTL (V_TT = 1.2 V and V_REF = 0.8 V) or GTLP (V_TT = 1.5 V and V_REF = 1 V) signal levels.

Normally, the B port operates at GTLP signal levels. The A-port and control inputs operate at LVTTL logic levels, but are 5-V tolerant and are compatible with TTL and 5-V CMOS inputs. V_REF is the B port differential input reference voltage.

This device is fully specified for live-insertion applications using I_off, power-up 3-state, and BIAS V_CC. The I_off circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. The BIAS V_CC circuitry precharges and preconditions the B-port input/output connections, preventing disturbance of active data on the backplane during card insertion or removal, and permits true live-insertion capability.

This GTLP device features TI-OPC circuitry, which actively limits the overshoot caused by improperly terminated backplanes, unevenly distributed cards, or empty slots during low-to-high signal transitions. This improves signal integrity, which allows adequate noise margin to be maintained at higher frequencies.

High-drive GTLP backplane interface devices feature adjustable edge-rate control (ERC\). Changing the ERC\ input voltage between GND and V_CC adjusts the B-port output rise and fall times. This allows the designer to optimize system data-transfer rate and signal integrity to the backplane load.

When V_CC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, the output-enable (OE\) input should be tied to V_CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

• TI-OPC? Circuitry Limits Ringing on Unevenly Loaded Backplanes
• OEC? Circuitry Improves Signal Integrity and Reduces Electromagnetic Interference
• Bidirectional Interface Between GTLP Signal Levels and LVTTL Logic Levels
• Split LVTTL Port Provides a Feedback Path for Control and Diagnostics Monitoring
• LVTTL Interfaces Are 5-V Tolerant
• High-Drive GTLP Outputs (100 mA)
• LVTTL Outputs (–24 mA/24 mA)
• Variable Edge-Rate Control (ERC\) Input Selects GTLP Rise and Fall Times for Optimal Data-Transfer Rate and Signal Integrity in Distributed Loads
• Ioff, Power-Up 3-State, and BIAS VCC Support Live Insertion
• Polarity Control Selects True or Complementary Outputs
• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
• ESD Protection Exceeds JESD 22
  • 2000-V Human-Body Model (A114-A)
  • 200-V Machine Model (A115-A)
  • 1000-V Charged-Device Model (C101)

OEC, TI, and TI-OPC are trademarks of Texas Instruments.

• Technology Family
• GTLP
• Applications
• GTL
• Rating
• Catalog
• Operating temperature range (C)
• -40 to 85

SN74GTLP1394的完整型号有：SN74GTLP1394D、SN74GTLP1394DR、SN74GTLP1394PW、SN74GTLP1394PWR，以下是这些产品的关键参数及官网采购报价：

SN74GTLP1394D，工作温度：-40 to 85，封装：SOIC (D)-16，包装数量MPQ：40个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74GTLP1394D的批量USD价格：1.501（1000+）

SN74GTLP1394DR，工作温度：-40 to 85，封装：SOIC (D)-16，包装数量MPQ：2500个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74GTLP1394DR的批量USD价格：1.251（1000+）

SN74GTLP1394PW，工作温度：-40 to 85，封装：TSSOP (PW)-16，包装数量MPQ：90个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74GTLP1394PW的批量USD价格：1.501（1000+）

SN74GTLP1394PWR，工作温度：-40 to 85，封装：TSSOP (PW)-16，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74GTLP1394PWR的批量USD价格：1.251（1000+）

14-24-LOGIC-EVM — 支持 14 到 24 引脚 PW、DB、D、DW、NS、DYY 和 DGV 封装的通用逻辑 EVM

该 EVM 设计用于支持采用 14 至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。

14-24-NL-LOGIC-EVM — Generic 14 through 24 pin non-leaded package evaluation module

Flexible EVM designed to support any logic or translation device that has a BQA, BQB, RGY (14-24 pin), RSV, RJW, or RHL package.