- 制造厂商:TI
- 产品类别:逻辑和电压转换
- 技术类目:缓冲器、驱动器和收发器 - 反向缓冲器和驱动器
- 功能描述:6 通道、2V 至 5.5V 反相器
- 点击这里打开及下载SN74LV04A的技术文档资料
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This hex inverter is designed for 2-V to 5.5-V VCC operation. The SN74LV04A device contains six independent inverters. This device perform the Boolean function Y = A.
- 2-V to 5.5-V VCC Operation
- Max tpd of 6.5 ns at 5 V
- Latch-Up Performance Exceeds 250 mA Per JESD 17
- Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C
- Typical VOHV (Output VOH Undershoot) > 2.3 V at VCC = 3.3 V, TA = 25°C
- Support Mixed-Mode Voltage Operation on All Ports
- Ioff Supports Partial-Power-Down Mode Operation
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model
- 200-V Machine Model
- 1000-V Charged-Device Model
- Technology Family
- LV-A
- Supply voltage (Min) (V)
- 2
- Supply voltage (Max) (V)
- 5.5
- Number of channels (#)
- 6
- IOL (Max) (mA)
- 12
- IOH (Max) (mA)
- -12
- ICC (Max) (uA)
- 20
- Input type
- Standard CMOS
- Output type
- Push-Pull
- Features
- Balanced outputs, Very high speed (tpd 5-10ns), Partial power down (Ioff), Over-voltage tolerant inputs
- Rating
- Catalog
SN74LV04A的完整型号有:SN74LV04AD、SN74LV04ADBR、SN74LV04ADGVR、SN74LV04ADR、SN74LV04ANSR、SN74LV04APW、SN74LV04APWR、SN74LV04APWRG4、SN74LV04APWT、SN74LV04ARGYR,以下是这些产品的关键参数及官网采购报价:
SN74LV04AD,工作温度:-40 to 125,封装:SOIC (D)-14,包装数量MPQ:50个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LV04AD的批量USD价格:0.333(1000+)
SN74LV04ADBR,工作温度:-40 to 125,封装:SSOP (DB)-14,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LV04ADBR的批量USD价格:0.146(1000+)
SN74LV04ADGVR,工作温度:-40 to 125,封装:TVSOP (DGV)-14,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LV04ADGVR的批量USD价格:0.133(1000+)
SN74LV04ADR,工作温度:-40 to 125,封装:SOIC (D)-14,包装数量MPQ:2500个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LV04ADR的批量USD价格:0.12(1000+)
SN74LV04ANSR,工作温度:-40 to 125,封装:SO (NS)-14,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LV04ANSR的批量USD价格:0.146(1000+)
SN74LV04APW,工作温度:-40 to 125,封装:TSSOP (PW)-14,包装数量MPQ:90个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LV04APW的批量USD价格:0.333(1000+)
SN74LV04APWR,工作温度:-40 to 125,封装:TSSOP (PW)-14,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LV04APWR的批量USD价格:0.133(1000+)
SN74LV04APWRG4,工作温度:-40 to 125,封装:TSSOP (PW)-14,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LV04APWRG4的批量USD价格:0.153(1000+)
SN74LV04APWT,工作温度:-40 to 125,封装:TSSOP (PW)-14,包装数量MPQ:250个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LV04APWT的批量USD价格:0.333(1000+)
SN74LV04ARGYR,工作温度:-40 to 125,封装:VQFN (RGY)-14,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-2-260C-1 YEAR,引脚镀层/焊球材料:NIPDAU,TI官网SN74LV04ARGYR的批量USD价格:0.14(1000+)
14-24-LOGIC-EVM — 支持 14 到 24 引脚 PW、DB、D、DW、NS、DYY 和 DGV 封装的通用逻辑 EVM
该 EVM 设计用于支持采用 14 至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。
14-24-NL-LOGIC-EVM — Generic 14 through 24 pin non-leaded package evaluation module
Flexible EVM designed to support any logic or translation device that has a BQA, BQB, RGY (14-24 pin), RSV, RJW, or RHL package.