- 制造厂商:TI
- 产品类别:逻辑和电压转换
- 技术类目:缓冲器、驱动器和收发器 - 同相缓冲器和驱动器
- 功能描述:具有漏极开路输出的 6 通道、2V 至 5.5V 缓冲器
- 点击这里打开及下载SN74LV07A的技术文档资料
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These hex buffers/drivers are designed for 2-V to
5.5-V VCC operation.
The SN74LV07A device performs the Boolean function Y = A in positive logic.
- 2-V to 5.5-V VCC Operation
- Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C
- Typical VOHV (Output VOH Undershoot) > 2.3 V at VCC = 3.3 V, TA = 25°C
- Outputs are Disabled During Power Up and Power Down With Inputs Tied to VCC
- Support Mixed-Mode Voltage Operation on All Ports
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model
- 200-V Machine Model
- 1000-V Charged-Device Model
- Technology Family
- LV-A
- Supply voltage (Min) (V)
- 2
- Supply voltage (Max) (V)
- 5.5
- Number of channels (#)
- 6
- IOL (Max) (mA)
- 16
- ICC (Max) (uA)
- 20
- IOH (Max) (mA)
- 0
- Input type
- Standard CMOS
- Output type
- Open-Drain
- Features
- Very high speed (tpd 5-10ns), Partial power down (Ioff), Over-voltage tolerant inputs
- Rating
- Catalog
SN74LV07A的完整型号有:SN74LV07AD、SN74LV07ADBR、SN74LV07ADGVR、SN74LV07ADR、SN74LV07ANS、SN74LV07ANSR、SN74LV07APW、SN74LV07APWR、SN74LV07APWRG3、SN74LV07APWRG4、SN74LV07APWT,以下是这些产品的关键参数及官网采购报价:
SN74LV07AD,工作温度:-40 to 125,封装:SOIC (D)-14,包装数量MPQ:50个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LV07AD的批量USD价格:.348(1000+)
SN74LV07ADBR,工作温度:-40 to 125,封装:SSOP (DB)-14,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LV07ADBR的批量USD价格:.163(1000+)
SN74LV07ADGVR,工作温度:-40 to 125,封装:TVSOP (DGV)-14,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LV07ADGVR的批量USD价格:.148(1000+)
SN74LV07ADR,工作温度:-40 to 125,封装:SOIC (D)-14,包装数量MPQ:2500个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LV07ADR的批量USD价格:.134(1000+)
SN74LV07ANS,工作温度:PropertyValue,封装:SO (NS)-14,包装数量MPQ:50个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LV07ANS的批量USD价格:.363(1000+)
SN74LV07ANSR,工作温度:-40 to 125,封装:SO (NS)-14,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LV07ANSR的批量USD价格:.163(1000+)
SN74LV07APW,工作温度:-40 to 125,封装:TSSOP (PW)-14,包装数量MPQ:90个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LV07APW的批量USD价格:.348(1000+)
SN74LV07APWR,工作温度:-40 to 125,封装:TSSOP (PW)-14,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:SN,TI官网SN74LV07APWR的批量USD价格:.148(1000+)
SN74LV07APWRG3,工作温度:-40 to 125,封装:TSSOP (PW)-14,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:SN,TI官网SN74LV07APWRG3的批量USD价格:.17(1000+)
SN74LV07APWRG4,工作温度:-40 to 125,封装:TSSOP (PW)-14,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LV07APWRG4的批量USD价格:.17(1000+)
SN74LV07APWT,工作温度:-40 to 125,封装:TSSOP (PW)-14,包装数量MPQ:250个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LV07APWT的批量USD价格:.348(1000+)
14-24-LOGIC-EVM — 支持 14 到 24 引脚 PW、DB、D、DW、NS、DYY 和 DGV 封装的通用逻辑 EVM
该 EVM 设计用于支持采用 14 至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。