- 制造厂商:TI
- 产品类别:逻辑和电压转换
- 技术类目:触发器、锁存器和寄存器 - D 型触发器
- 功能描述:具有清零端的八路 D 型触发器
- 点击这里打开及下载SN74LV273A的技术文档资料
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The SN74LV273A device is an octal D-type flip-flop designed for 2-V to 5.5-V VCC operation.
- 2-V to 5.5-V VCC Operation
- Max tpd of 10.5 ns at 5 V
- Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C
- Typical VOHV (Output VOH Undershoot) > 2.3 V at VCC = 3.3 V, TA = 25°C
- Ioff Supports Partial-Power-Down Mode Operation
- Supports Mixed-Mode Voltage Operation on All Ports
- Latch-Up Performance Exceeds 250 mA Per JESD 17
- ESD Protection Exceeds JESD 22
- 3000-V Human-Body Model
- 200-V Machine Model
- 2000-V Charged-Device Model
- Number of channels (#)
- 8
- Technology Family
- LV-A
- Supply voltage (Min) (V)
- 2
- Supply voltage (Max) (V)
- 5.5
- Input type
- Standard CMOS
- Output type
- Push-Pull
- Clock Frequency (Max) (MHz)
- 70
- IOL (Max) (mA)
- 12
- IOH (Max) (mA)
- -12
- ICC (Max) (uA)
- 20
- Features
- Balanced outputs, High speed (tpd 10-50ns), Over-voltage tolerant inputs, Partial power down (Ioff)
SN74LV273A的完整型号有:SN74LV273ADBR、SN74LV273ADGVR、SN74LV273ADW、SN74LV273ADWR、SN74LV273ANSR、SN74LV273APW、SN74LV273APWR、SN74LV273APWRG4、SN74LV273APWT、SN74LV273ARGYR,以下是这些产品的关键参数及官网采购报价:
SN74LV273ADBR,工作温度:-40 to 125,封装:SSOP (DB)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LV273ADBR的批量USD价格:0.246(1000+)
SN74LV273ADGVR,工作温度:-40 to 125,封装:TVSOP (DGV)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LV273ADGVR的批量USD价格:0.224(1000+)
SN74LV273ADW,工作温度:-40 to 125,封装:SOIC (DW)-20,包装数量MPQ:25个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LV273ADW的批量USD价格:0.269(1000+)
SN74LV273ADWR,工作温度:-40 to 125,封装:SOIC (DW)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LV273ADWR的批量USD价格:0.246(1000+)
SN74LV273ANSR,工作温度:-40 to 125,封装:SO (NS)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LV273ANSR的批量USD价格:0.246(1000+)
SN74LV273APW,工作温度:-40 to 125,封装:TSSOP (PW)-20,包装数量MPQ:70个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LV273APW的批量USD价格:0.269(1000+)
SN74LV273APWR,工作温度:-40 to 125,封装:TSSOP (PW)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LV273APWR的批量USD价格:0.224(1000+)
SN74LV273APWRG4,工作温度:-40 to 125,封装:TSSOP (PW)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LV273APWRG4的批量USD价格:0.258(1000+)
SN74LV273APWT,工作温度:-40 to 125,封装:TSSOP (PW)-20,包装数量MPQ:250个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LV273APWT的批量USD价格:0.269(1000+)
SN74LV273ARGYR,工作温度:-40 to 125,封装:VQFN (RGY)-20,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-2-260C-1 YEAR,引脚镀层/焊球材料:NIPDAU,TI官网SN74LV273ARGYR的批量USD价格:0.235(1000+)
14-24-LOGIC-EVM — 支持 14 到 24 引脚 PW、DB、D、DW、NS、DYY 和 DGV 封装的通用逻辑 EVM
该 EVM 设计用于支持采用 14 至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。
14-24-NL-LOGIC-EVM — Generic 14 through 24 pin non-leaded package evaluation module
Flexible EVM designed to support any logic or translation device that has a BQA, BQB, RGY (14-24 pin), RSV, RJW, or RHL package.