- 制造厂商:TI
- 产品类别:逻辑和电压转换
- 技术类目:触发器、锁存器和寄存器 - D 型触发器
- 功能描述:双路正边沿触发式 D 型触发器
- 点击这里打开及下载SN74LV74A的技术文档资料
- TI代理渠道,提供当日发货、严格的质量标准,满足您的目标价格
These dual positive-edge-triggered D-type flip-flops are designed for 2-V to 5.5-V VCC operation.
- 2-V to 5.5-V VCC Operation
- Maximum tpd of 8.5 ns at 5 V
- Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C
- Typical VOHV (Output VOH Undershoot) > 2.3 V at VCC = 3.3 V, TA = 25°C
- Support Mixed-Mode Voltage Operation on All Ports
- Ioff Supports Partial-Power-Down Mode Operation
- Latch-up Performance Exceeds 250 mA Per JESD 17
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 500-V Charged-Device Model (C101)
- Number of channels (#)
- 2
- Technology Family
- LV-A
- Supply voltage (Min) (V)
- 2
- Supply voltage (Max) (V)
- 5.5
- Input type
- Standard CMOS
- Output type
- Push-Pull
- Clock Frequency (Max) (MHz)
- 110
- IOL (Max) (mA)
- 12
- IOH (Max) (mA)
- -12
- ICC (Max) (uA)
- 20
- Features
- Balanced outputs, High speed (tpd 10-50ns), Over-voltage tolerant inputs, Partial power down (Ioff)
SN74LV74A的完整型号有:SN74LV74AD、SN74LV74ADBR、SN74LV74ADGVR、SN74LV74ADR、SN74LV74ANSR、SN74LV74APW、SN74LV74APWR、SN74LV74APWRG4、SN74LV74APWT、SN74LV74ARGYR,以下是这些产品的关键参数及官网采购报价:
SN74LV74AD,工作温度:-40 to 125,封装:SOIC (D)-14,包装数量MPQ:50个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LV74AD的批量USD价格:.333(1000+)
SN74LV74ADBR,工作温度:-40 to 125,封装:SSOP (DB)-14,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LV74ADBR的批量USD价格:.146(1000+)
SN74LV74ADGVR,工作温度:-40 to 125,封装:TVSOP (DGV)-14,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LV74ADGVR的批量USD价格:.133(1000+)
SN74LV74ADR,工作温度:-40 to 125,封装:SOIC (D)-14,包装数量MPQ:2500个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LV74ADR的批量USD价格:.12(1000+)
SN74LV74ANSR,工作温度:-40 to 125,封装:SO (NS)-14,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LV74ANSR的批量USD价格:.146(1000+)
SN74LV74APW,工作温度:-40 to 125,封装:TSSOP (PW)-14,包装数量MPQ:90个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LV74APW的批量USD价格:.333(1000+)
SN74LV74APWR,工作温度:-40 to 125,封装:TSSOP (PW)-14,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:SN,TI官网SN74LV74APWR的批量USD价格:.133(1000+)
SN74LV74APWRG4,工作温度:-40 to 125,封装:TSSOP (PW)-14,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LV74APWRG4的批量USD价格:.153(1000+)
SN74LV74APWT,工作温度:-40 to 125,封装:TSSOP (PW)-14,包装数量MPQ:250个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LV74APWT的批量USD价格:.333(1000+)
SN74LV74ARGYR,工作温度:-40 to 125,封装:VQFN (RGY)-14,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-2-260C-1 YEAR,引脚镀层/焊球材料:NIPDAU,TI官网SN74LV74ARGYR的批量USD价格:.146(1000+)
14-24-LOGIC-EVM — 支持 14 到 24 引脚 PW、DB、D、DW、NS、DYY 和 DGV 封装的通用逻辑 EVM
该 EVM 设计用于支持采用 14 至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。
14-24-NL-LOGIC-EVM — Generic 14 through 24 pin non-leaded package evaluation module
Flexible EVM designed to support any logic or translation device that has a BQA, BQB, RGY (14-24 pin), RSV, RJW, or RHL package.