- 制造厂商:TI
- 产品类别:逻辑和电压转换
- 技术类目:逻辑门 - 与非门
- 功能描述:具有施密特触发输入的单路 2 输入、1.65V 至 5.5V 与非门
- 点击这里打开及下载SN74LVC1G132的技术文档资料
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The SN74LVC1G132 device contains one 2-input NAND gate with Schmitt-trigger inputs designed for 1.65-V to 5.5-V VCC operation and performs the Boolean function Y = A × B or Y = A + B in positive logic.
Because of Schmitt action, this device has different input threshold levels for positive-going (VT+) and negative-going (VT–) signals.
This device can be triggered from the slowest of input ramps and still give clean jitter-free output signals.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
- Available in Texas Instruments NanoStar? and NanoFree? Packages
- Supports 5-V VCC Operation
- Inputs Accept Voltages to 5.5 V
- Max tpd of 5.3 ns at 3.3 V
- Low Power Consumption, 10-μA Maximum ICC
- ±24-mA Output Drive at 3.3 V
- Ioff Supports Partial-Power-Down Mode Operation
- Technology Family
- LVC
- Supply voltage (Min) (V)
- 1.65
- Supply voltage (Max) (V)
- 5.5
- Number of channels (#)
- 1
- Inputs per channel
- 2
- IOL (Max) (mA)
- 32
- IOH (Max) (mA)
- -32
- Input type
- Schmitt-Trigger
- Output type
- Push-Pull
- Features
- Partial power down (Ioff), Over-voltage tolerant inputs, Ultra high speed (tpd <5ns)
- Data rate (Max) (Mbps)
- 100
- Rating
- Catalog
SN74LVC1G132的完整型号有:74LVC1G132DCKRG4、74LVC1G132DCKTG4、SN74LVC1G132DBVR、SN74LVC1G132DBVT、SN74LVC1G132DCKR、SN74LVC1G132DCKT,以下是这些产品的关键参数及官网采购报价:
74LVC1G132DCKRG4,工作温度:-40 to 125,封装:SC70 (DCK)-5,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网74LVC1G132DCKRG4的批量USD价格:.081(1000+)
74LVC1G132DCKTG4,工作温度:-40 to 125,封装:SC70 (DCK)-5,包装数量MPQ:250个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网74LVC1G132DCKTG4的批量USD价格:.281(1000+)
SN74LVC1G132DBVR,工作温度:-40 to 125,封装:SOT-23 (DBV)-5,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:SN,TI官网SN74LVC1G132DBVR的批量USD价格:.07(1000+)
SN74LVC1G132DBVT,工作温度:-40 to 125,封装:SOT-23 (DBV)-5,包装数量MPQ:250个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LVC1G132DBVT的批量USD价格:.27(1000+)
SN74LVC1G132DCKR,工作温度:-40 to 125,封装:SC70 (DCK)-5,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LVC1G132DCKR的批量USD价格:.061(1000+)
SN74LVC1G132DCKT,工作温度:-40 to 125,封装:SC70 (DCK)-5,包装数量MPQ:250个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:SN,TI官网SN74LVC1G132DCKT的批量USD价格:.27(1000+)
5-8-LOGIC-EVM — 支持 5 至 8 引脚 DCK、DCT、DCU、DRL 和 DBV 封装的通用逻辑 EVM
灵活的 EVM 设计用于支持具有 5 至 8 引脚数且采用 DCK、DCT、DCU、DRL 或 DBV 封装的任何器件。