- 制造厂商:TI
- 产品类别:逻辑和电压转换
- 技术类目:缓冲器、驱动器和收发器 - 反向缓冲器和驱动器
- 功能描述:具有施密特触发输入的单路 1.65V 至 5.5V 反相器
- 点击这里打开及下载SN74LVC1G14的技术文档资料
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This single Schmitt-trigger inverter is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC1G14 device contains one inverter and performs the Boolean function Y = A. The device functions as an independent inverter with Schmitt-trigger inputs, so the device has different input threshold levels for positive-going (VT+) and negative-going (VT–) signals to provide hysteresis (ΔVT) which makes the device tolerant to slow or noisy input signals.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
- Available in the Texas Instruments NanoFree? Package
- Supports 5-V VCC Operation
- Inputs Accept Voltages to 5.5 V
- Max tpd of 4.6 ns at 3.3 V
- Low Power Consumption, 10-μA Max ICC
- ±24-mA Output Drive at 3.3 V
- Ioff Supports Partial-Power-Down Mode Operation
- Technology Family
- LVC
- Supply voltage (Min) (V)
- 1.65
- Supply voltage (Max) (V)
- 5.5
- Number of channels (#)
- 1
- IOL (Max) (mA)
- 32
- IOH (Max) (mA)
- -32
- ICC (Max) (uA)
- 10
- Input type
- Schmitt-Trigger
- Output type
- Push-Pull
- Features
- Balanced outputs, Very high speed (tpd 5-10ns), Partial power down (Ioff), Over-voltage tolerant inputs
- Rating
- Catalog
SN74LVC1G14的完整型号有:SN74LVC1G14DBVR、SN74LVC1G14DBVRG4、SN74LVC1G14DBVT、SN74LVC1G14DBVTG4、SN74LVC1G14DCKR、SN74LVC1G14DCKT、SN74LVC1G14DCKTG4、SN74LVC1G14DPWR、SN74LVC1G14DRLR、SN74LVC1G14DRYR、SN74LVC1G14DSFR、SN74LVC1G14YZPR、SN74LVC1G14YZVR,以下是这些产品的关键参数及官网采购报价:
SN74LVC1G14DBVR,工作温度:-40 to 125,封装:SOT-23 (DBV)-5,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:SN,TI官网SN74LVC1G14DBVR的批量USD价格:.032(1000+)
SN74LVC1G14DBVRG4,工作温度:-40 to 125,封装:SOT-23 (DBV)-5,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LVC1G14DBVRG4的批量USD价格:.081(1000+)
SN74LVC1G14DBVT,工作温度:-40 to 125,封装:SOT-23 (DBV)-5,包装数量MPQ:250个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LVC1G14DBVT的批量USD价格:.27(1000+)
SN74LVC1G14DBVTG4,工作温度:-40 to 125,封装:SOT-23 (DBV)-5,包装数量MPQ:250个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LVC1G14DBVTG4的批量USD价格:.281(1000+)
SN74LVC1G14DCKR,工作温度:-40 to 125,封装:SC70 (DCK)-5,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:SN,TI官网SN74LVC1G14DCKR的批量USD价格:.03(1000+)
SN74LVC1G14DCKT,工作温度:-40 to 125,封装:SC70 (DCK)-5,包装数量MPQ:250个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:SN,TI官网SN74LVC1G14DCKT的批量USD价格:.27(1000+)
SN74LVC1G14DCKTG4,工作温度:-40 to 125,封装:SC70 (DCK)-5,包装数量MPQ:250个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LVC1G14DCKTG4的批量USD价格:.281(1000+)
SN74LVC1G14DPWR,工作温度:-40 to 85,封装:X2SON (DPW)-5,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LVC1G14DPWR的批量USD价格:.066(1000+)
SN74LVC1G14DRLR,工作温度:-40 to 125,封装:SOT-5X3 (DRL)-5,包装数量MPQ:4000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAUAG,TI官网SN74LVC1G14DRLR的批量USD价格:.067(1000+)
SN74LVC1G14DRYR,工作温度:-40 to 125,封装:SON (DRY)-6,包装数量MPQ:5000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LVC1G14DRYR的批量USD价格:.086(1000+)
SN74LVC1G14DSFR,工作温度:-40 to 125,封装:SON (DSF)-6,包装数量MPQ:5000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAUAG,TI官网SN74LVC1G14DSFR的批量USD价格:.084(1000+)
SN74LVC1G14YZPR,工作温度:-40 to 85,封装:DSBGA (YZP)-5,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:SNAGCU,TI官网SN74LVC1G14YZPR的批量USD价格:.164(1000+)
SN74LVC1G14YZVR,工作温度:-40 to 85,封装:DSBGA (YZV)-4,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:SNAGCU,TI官网SN74LVC1G14YZVR的批量USD价格:.102(1000+)
5-8-LOGIC-EVM — 支持 5 至 8 引脚 DCK、DCT、DCU、DRL 和 DBV 封装的通用逻辑 EVM
灵活的 EVM 设计用于支持具有 5 至 8 引脚数且采用 DCK、DCT、DCU、DRL 或 DBV 封装的任何器件。