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- 制造厂商:TI
- 产品类别:逻辑和电压转换
- 技术类目:缓冲器、驱动器和收发器 - 同相缓冲器和驱动器
- 功能描述:具有施密特触发输入的汽车类单路 1.65V 至 6.5V 缓冲器
- 点击这里打开及下载SN74LVC1G17-Q1的技术文档资料
- TI代理渠道,提供当日发货、严格的质量标准,满足您的目标价格
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This single Schmitt-trigger buffer is designed for
1.65-V to 5.5-V VCC operation.
The SN74LVC1G17-Q1 device contains one buffer and performs the Boolean function Y = A.
The CMOS device has high output drive while maintaining low static power dissipation over a broad VCC operating range.
The SN74LVC1G17-Q1 is available in a variety of packages.
- Qualified for Automotive Applications
- Supports 5-V VCC operation
- Inputs accept voltages to 5.5 V
- Max tpd of 8 ns at 3.3 V
- Low power consumption, 20-μA Max ICC
- ±24-mA Output drive at 3.3 V
- Ioff Supports live insertion, partial-power-down mode, and back-drive protection
- ESD protection exceeds JEDEC JS-001
- 2000-V Human-body model
- 1000-V Charged-device model
- Technology Family
- LVC
- Supply voltage (Min) (V)
- 1.65
- Supply voltage (Max) (V)
- 6.5
- Number of channels (#)
- 1
- IOL (Max) (mA)
- 32
- ICC (Max) (uA)
- 20
- IOH (Max) (mA)
- -32
- Input type
- Schmitt-Trigger
- Output type
- Push-Pull
- Features
- Balanced outputs, Very high speed (tpd 5-10ns), Partial power down (Ioff), Over-voltage tolerant inputs
- Rating
- Automotive
SN74LVC1G17-Q1的完整型号有:SN74LVC1G17QDBVRQ1、SN74LVC1G17QDCKRQ1、SN74LVC1G17QDRYRQ1,以下是这些产品的关键参数及官网采购报价:
SN74LVC1G17QDBVRQ1,工作温度:-40 to 125,封装:SOT-23 (DBV)-5,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LVC1G17QDBVRQ1的批量USD价格:.083(1000+)
SN74LVC1G17QDCKRQ1,工作温度:-40 to 125,封装:SC70 (DCK)-5,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:SN,TI官网SN74LVC1G17QDCKRQ1的批量USD价格:.083(1000+)
SN74LVC1G17QDRYRQ1,工作温度:-40 to 125,封装:SON (DRY)-6,包装数量MPQ:5000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LVC1G17QDRYRQ1的批量USD价格:.09(1000+)
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5-8-LOGIC-EVM — 支持 5 至 8 引脚 DCK、DCT、DCU、DRL 和 DBV 封装的通用逻辑 EVM
灵活的 EVM 设计用于支持具有 5 至 8 引脚数且采用 DCK、DCT、DCU、DRL 或 DBV 封装的任何器件。SN74LVC1G17Q1 IBIS Model
This reference design provides an electronics subsystem designed to drive an automotive augmented reality (AR) head-up display (HUD). DLP® technology enables bright, crisp, highly saturated head-up displays that project critical driving information onto the windshield of the car, reducing (...)
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