- 制造厂商：TI
- 产品类别：逻辑和电压转换
- 技术类目：触发器、锁存器和寄存器 - D 型触发器
- 功能描述：具有异步清零功能的增强型产品单路 D 型触发器
- 点击这里打开及下载SN74LVC1G175-EP的技术文档资料
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This single D-type flip-flop is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC1G175 has an asynchronous clear (CLR) input. When CLR is high, data from the input pin (D) is transferred to the output pin (Q) on the clock’s (CLK) rising edge. When CLR is low, Q is forced into the low state, regardless of the clock edge or data on D.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
- Supports 5-V VCC Operation
- Inputs Accept Voltages to 5.5 V
- Max tpd of 4.3 ns at 3.3 V
- Low Power Consumption, 10-μA Max ICC
- ±24-mA Output Drive at 3.3 V
- Ioff Supports Partial Power-Down-Mode Operation
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
- APPLICATIONS
- Controlled Baseline
- One Assembly/Test Site
- One Fabrication Site
- Available in Military (–55°C/125°C) Temperature Range(1)
- Extended Product Life Cycle
- Extended Product-Change Notification
- Product Traceability
(1) Additional temperature ranges available - contact factory
- Number of channels (#)
- 1
- Technology Family
- LVC
- Supply voltage (Min) (V)
- 1.65
- Supply voltage (Max) (V)
- 5.5
- Input type
- Standard CMOS
- Output type
- Push-Pull
- Clock Frequency (Max) (MHz)
- 150
- IOL (Max) (mA)
- 32
- IOH (Max) (mA)
- -32
- ICC (Max) (uA)
- 10
- Features
- Balanced outputs, Very high speed (tpd 5-10ns), Over-voltage tolerant inputs, Partial power down (Ioff)
SN74LVC1G175-EP的完整型号有：CLVC1G175MDCKREP、CLVC1G175MDCKREPG4、V62/06633-01XE，以下是这些产品的关键参数及官网采购报价：
CLVC1G175MDCKREP，工作温度：-55 to 125，封装：SC70 (DCK)-6，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网CLVC1G175MDCKREP的批量USD价格：.62（1000+）
CLVC1G175MDCKREPG4，工作温度：-55 to 125，封装：SC70 (DCK)-6，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网CLVC1G175MDCKREPG4的批量USD价格：.62（1000+）
V62/06633-01XE，工作温度：-55 to 125，封装：SC70 (DCK)-6，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网V62/06633-01XE的批量USD价格：.62（1000+）
CLVC1G175MDCKREP，工作温度：-55 to 125，封装：SC70 (DCK)-6，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网CLVC1G175MDCKREP的批量USD价格：.62（1000+）
CLVC1G175MDCKREPG4，工作温度：-55 to 125，封装：SC70 (DCK)-6，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网CLVC1G175MDCKREPG4的批量USD价格：.62（1000+）
V62/06633-01XE，工作温度：-55 to 125，封装：SC70 (DCK)-6，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网V62/06633-01XE的批量USD价格：.62（1000+）
