- 制造厂商：TI
- 产品类别：逻辑和电压转换
- 技术类目：专用逻辑 IC - 数字多路信号分离器和解码器
- 功能描述：3 选 2 解码器/多路复用器
- 点击这里打开及下载SN74LVC1G29的技术文档资料
- TI代理渠道，提供当日发货、严格的质量标准，满足您的目标价格
This decoder is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC1G29 device is a 2-of-3 decoder/demultiplexer. When the enable (G) input signal is low, only one of the outputs is in the low state, depending on the input levels of A0 and A1. When G is high, Y0, Y1, and Y2 are high, regardless of the input states.
This device is fuly specified for partial-power-down applications using Ioff. The Ioff circuitry disable the outputs, preventing damaging current backflow through the device when it is powered down.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
- Available in the Texas Instruments NanoFree Package
- Supports 5-V VCC Operation
- Inputs Accept Voltages to 5.5 V
- Supports Down Translation to VCC
- Max tpd of 5.1 ns at 3.3 V
- Low Power Consumption, 10-μA Max ICC
- ±24-mA Output Drive at 3.3 V
- Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C
- Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25°C
- Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
- Technology Family
- LVC
- Number of channels (#)
- 1
- Operating temperature range (C)
- -40 to 85
- Rating
- Catalog
- ICC (Max) (uA)
- 10
SN74LVC1G29的完整型号有：SN74LVC1G29DCTR、SN74LVC1G29DCUR、SN74LVC1G29DCUT、SN74LVC1G29YZPR，以下是这些产品的关键参数及官网采购报价：
SN74LVC1G29DCTR，工作温度：-40 to 85，封装：SM8 (DCT)-8，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVC1G29DCTR的批量USD价格：0.176（1000+）
SN74LVC1G29DCUR，工作温度：-40 to 85，封装：VSSOP (DCU)-8，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVC1G29DCUR的批量USD价格：0.135（1000+）
SN74LVC1G29DCUT，工作温度：-40 to 85，封装：VSSOP (DCU)-8，包装数量MPQ：250个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVC1G29DCUT的批量USD价格：0.335（1000+）
SN74LVC1G29YZPR，工作温度：-40 to 85，封装：DSBGA (YZP)-8，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：SNAGCU，TI官网SN74LVC1G29YZPR的批量USD价格：0.195（1000+）
5-8-LOGIC-EVM — 支持 5 至 8 引脚 DCK、DCT、DCU、DRL 和 DBV 封装的通用逻辑 EVM
灵活的 EVM 设计用于支持具有 5 至 8 引脚数且采用 DCK、DCT、DCU、DRL 或 DBV 封装的任何器件。
