This device is designed for 1.65-V to 5.5-V V_CC operation.

The SN74LVC1G3208 device is a single 3-input positive OR-AND gate. It performs the Boolean function Y = (A + B) ● C in positive logic.

By tying one input to GND or V_CC, the SN74LVC1G3208 device offers two more functions. When C is tied to V_CC, this device performs as a 2-input OR gate (Y = A + B). When A is tied to GND, the device works as a 2-input AND gate (Y = B ● C). This device also works as a 2-input AND gate when B is tied to GND (Y = A ● C).

NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

• Available in the Texas Instruments NanoStar and NanoFree Packages
• Supports 5-V VCC Operation
• Inputs Accept Voltages to 5.5 V
• Provides Down Translation to VCC
• Max tpd of 5 ns at 3.3 V
• Low Power Consumption, 10-μA Max ICC
• ±24-mA Output Drive at 3.3 V
• Input Hysteresis Allows Slow Input Transition and Better Switching Noise Immunity at the Input (Vhys = 250 mV Typ @ 3.3 V)
• Can Be Used in Three Combinations:
  • OR-AND Gate
  • OR Gate
  • AND Gate
• Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
• ESD Protection Exceeds JESD 22
  • 2000-V Human-Body Model (A114-A)
  • 200-V Machine Model (A115-A)
  • 1000-V Charged-Device Model (C101)

• Technology Family
• LVC
• Supply voltage (Min) (V)
• 1.65
• Supply voltage (Max) (V)
• 5.5
• Number of channels (#)
• 1
• Inputs per channel
• 3
• IOL (Max) (mA)
• 32
• IOH (Max) (mA)
• -32
• Input type
• Standard CMOS
• Output type
• Push-Pull
• Features
• Partial power down (Ioff), Over-voltage tolerant inputs, Ultra high speed (tpd <5ns)
• Data rate (Max) (Mbps)
• 100
• Rating
• Catalog
• Operating temperature range (C)
• -40 to 125, -40 to 85

SN74LVC1G3208的完整型号有：SN74LVC1G3208DBVR、SN74LVC1G3208DBVT、SN74LVC1G3208DCKR、SN74LVC1G3208DCKT、SN74LVC1G3208YZPR，以下是这些产品的关键参数及官网采购报价：

SN74LVC1G3208DBVR，工作温度：-40 to 125，封装：SOT-23 (DBV)-6，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVC1G3208DBVR的批量USD价格：.061（1000+）

SN74LVC1G3208DBVT，工作温度：-40 to 125，封装：SOT-23 (DBV)-6，包装数量MPQ：250个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVC1G3208DBVT的批量USD价格：.261（1000+）

SN74LVC1G3208DCKR，工作温度：-40 to 125，封装：SC70 (DCK)-6，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVC1G3208DCKR的批量USD价格：.061（1000+）

SN74LVC1G3208DCKT，工作温度：-40 to 125，封装：SC70 (DCK)-6，包装数量MPQ：250个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVC1G3208DCKT的批量USD价格：.261（1000+）

SN74LVC1G3208YZPR，工作温度：-40 to 85，封装：DSBGA (YZP)-6，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：SNAGCU，TI官网SN74LVC1G3208YZPR的批量USD价格：.133（1000+）

5-8-LOGIC-EVM — 支持 5 至 8 引脚 DCK、DCT、DCU、DRL 和 DBV 封装的通用逻辑 EVM

灵活的 EVM 设计用于支持具有 5 至 8 引脚数且采用 DCK、DCT、DCU、DRL 或 DBV 封装的任何器件。