- 制造厂商：TI
- 产品类别：逻辑和电压转换
- 技术类目：触发器、锁存器和寄存器 - D 型锁存器
- 功能描述：具有三态输出的单路 D 型锁存器
- 点击这里打开及下载SN74LVC1G373的技术文档资料
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The SN74LVC1G373 device is a single D-type latch designed for 1.65-V to 5.5-V VCC operation.
This device is particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers. While the latch-enable (LE) input is high, the Q outputs follow the data (D) inputs. When LE is taken low, the Q outputs are latched at the logic levels set up at the D inputs.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
OE does not affect the internal operations of the latch. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.
- Available in the Texas Instruments NanoFree? Package
- Supports 5-V VCC Operation
- Inputs Accept Voltages to 5.5 V
- Provides Down Translation to VCC
- Max tpd of 4 ns at 3.3 V
- Low Power Consumption: 10-μA Maximum ICC
- ±24-mA Output Drive at 3.3 V
- Ioff Supports Partial-Power-Down Mode and Back Drive Protection
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- Number of channels (#)
- 1
- Technology Family
- LVC
- Supply voltage (Min) (V)
- 1.65
- Supply voltage (Max) (V)
- 5.5
- Input type
- Standard CMOS
- Output type
- 3-State
- Clock Frequency (Max) (MHz)
- 150
- IOL (Max) (mA)
- 32
- IOH (Max) (mA)
- -32
- ICC (Max) (uA)
- 10
- Features
- Balanced outputs, Very high speed (tpd 5-10ns), Over-voltage tolerant inputs, Partial power down (Ioff), Flow-through pinout
SN74LVC1G373的完整型号有：74LVC1G373DCKRG4、SN74LVC1G373DBVR、SN74LVC1G373DCKR、SN74LVC1G373YZPR，以下是这些产品的关键参数及官网采购报价：
74LVC1G373DCKRG4，工作温度：-40 to 125，封装：SC70 (DCK)-6，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网74LVC1G373DCKRG4的批量USD价格：.094（1000+）
SN74LVC1G373DBVR，工作温度：-40 to 125，封装：SOT-23 (DBV)-6，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVC1G373DBVR的批量USD价格：.082（1000+）
SN74LVC1G373DCKR，工作温度：-40 to 125，封装：SC70 (DCK)-6，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：SN，TI官网SN74LVC1G373DCKR的批量USD价格：.082（1000+）
SN74LVC1G373YZPR，工作温度：-40 to 85，封装：DSBGA (YZP)-6，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：SNAGCU，TI官网SN74LVC1G373YZPR的批量USD价格：.156（1000+）
5-8-LOGIC-EVM — 支持 5 至 8 引脚 DCK、DCT、DCU、DRL 和 DBV 封装的通用逻辑 EVM
灵活的 EVM 设计用于支持具有 5 至 8 引脚数且采用 DCK、DCT、DCU、DRL 或 DBV 封装的任何器件。
