- 制造厂商:TI
- 产品类别:逻辑和电压转换
- 技术类目:逻辑门 - XOR(异或)门
- 功能描述:单路 3 输入、1.65V 至 5.5V XOR(异或)门
- 点击这里打开及下载SN74LVC1G386的技术文档资料
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The SN74LVC1G386 device performs the Boolean function Y = A × B × C in positive logic.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
- Available in the Texas Instruments NanoStar and NanoFree Packages
- Supports 5-V VCC Operation
- Inputs Accept Voltages to 5.5 V
- Supports Down Translation to VCC
- Ioff Supports Live Insertion, Partial-Power-Down Mode, Back-Drive Protection
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
- Technology Family
- LVC
- Supply voltage (Min) (V)
- 1.65
- Supply voltage (Max) (V)
- 5.5
- Number of channels (#)
- 1
- Inputs per channel
- 3
- IOL (Max) (mA)
- 32
- Input type
- Standard CMOS
- IOH (Max) (mA)
- -32
- Output type
- Push-Pull
- Features
- Partial power down (Ioff), Over-voltage tolerant Inputs, Ultra high speed (tpd <5ns)
- Data rate (Max) (Mbps)
- 100
- Rating
- Catalog
- Operating temperature range (C)
- -40 to 125, -40 to 85
SN74LVC1G386的完整型号有:74LVC1G386DCKRG4、SN74LVC1G386DBVR、SN74LVC1G386DCKR、SN74LVC1G386DRYR、SN74LVC1G386DSFR、SN74LVC1G386YZPR,以下是这些产品的关键参数及官网采购报价:
74LVC1G386DCKRG4,工作温度:-40 to 125,封装:SC70 (DCK)-6,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网74LVC1G386DCKRG4的批量USD价格:0.084(1000+)
SN74LVC1G386DBVR,工作温度:-40 to 125,封装:SOT-23 (DBV)-6,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LVC1G386DBVR的批量USD价格:0.073(1000+)
SN74LVC1G386DCKR,工作温度:-40 to 125,封装:SC70 (DCK)-6,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LVC1G386DCKR的批量USD价格:0.073(1000+)
SN74LVC1G386DRYR,工作温度:-40 to 125,封装:SON (DRY)-6,包装数量MPQ:5000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LVC1G386DRYR的批量USD价格:0.086(1000+)
SN74LVC1G386DSFR,工作温度:-40 to 125,封装:SON (DSF)-6,包装数量MPQ:5000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LVC1G386DSFR的批量USD价格:0.088(1000+)
SN74LVC1G386YZPR,工作温度:-40 to 85,封装:DSBGA (YZP)-6,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:SNAGCU,TI官网SN74LVC1G386YZPR的批量USD价格:0.146(1000+)
5-8-LOGIC-EVM — 支持 5 至 8 引脚 DCK、DCT、DCU、DRL 和 DBV 封装的通用逻辑 EVM
灵活的 EVM 设计用于支持具有 5 至 8 引脚数且采用 DCK、DCT、DCU、DRL 或 DBV 封装的任何器件。