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SN74LVC1G386的基本参数
  • 制造厂商:TI
  • 产品类别:逻辑和电压转换
  • 技术类目:逻辑门 - XOR(异或)门
  • 功能描述:单路 3 输入、1.65V 至 5.5V XOR(异或)门
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SN74LVC1G386的产品详情:

The SN74LVC1G386 device performs the Boolean function Y = A × B × C in positive logic.

NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

SN74LVC1G386的优势和特性:
  • Available in the Texas Instruments NanoStar and NanoFree Packages
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Supports Down Translation to VCC
  • Ioff Supports Live Insertion, Partial-Power-Down Mode, Back-Drive Protection
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

SN74LVC1G386的参数(英文):
  • Technology Family
  • LVC
  • Supply voltage (Min) (V)
  • 1.65
  • Supply voltage (Max) (V)
  • 5.5
  • Number of channels (#)
  • 1
  • Inputs per channel
  • 3
  • IOL (Max) (mA)
  • 32
  • Input type
  • Standard CMOS
  • IOH (Max) (mA)
  • -32
  • Output type
  • Push-Pull
  • Features
  • Partial power down (Ioff), Over-voltage tolerant Inputs, Ultra high speed (tpd <5ns)
  • Data rate (Max) (Mbps)
  • 100
  • Rating
  • Catalog
  • Operating temperature range (C)
  • -40 to 125, -40 to 85
SN74LVC1G386具体的完整产品型号参数及价格(美元):

SN74LVC1G386的完整型号有:74LVC1G386DCKRG4、SN74LVC1G386DBVR、SN74LVC1G386DCKR、SN74LVC1G386DRYR、SN74LVC1G386DSFR、SN74LVC1G386YZPR,以下是这些产品的关键参数及官网采购报价:

74LVC1G386DCKRG4,工作温度:-40 to 125,封装:SC70 (DCK)-6,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网74LVC1G386DCKRG4的批量USD价格:0.084(1000+)

SN74LVC1G386DBVR,工作温度:-40 to 125,封装:SOT-23 (DBV)-6,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LVC1G386DBVR的批量USD价格:0.073(1000+)

SN74LVC1G386DCKR,工作温度:-40 to 125,封装:SC70 (DCK)-6,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LVC1G386DCKR的批量USD价格:0.073(1000+)

SN74LVC1G386DRYR,工作温度:-40 to 125,封装:SON (DRY)-6,包装数量MPQ:5000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LVC1G386DRYR的批量USD价格:0.086(1000+)

SN74LVC1G386DSFR,工作温度:-40 to 125,封装:SON (DSF)-6,包装数量MPQ:5000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LVC1G386DSFR的批量USD价格:0.088(1000+)

SN74LVC1G386YZPR,工作温度:-40 to 85,封装:DSBGA (YZP)-6,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:SNAGCU,TI官网SN74LVC1G386YZPR的批量USD价格:0.146(1000+)

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SN74LVC1G386的评估套件:

5-8-LOGIC-EVM — 支持 5 至 8 引脚 DCK、DCT、DCU、DRL 和 DBV 封装的通用逻辑 EVM

灵活的 EVM 设计用于支持具有 5 至 8 引脚数且采用 DCK、DCT、DCU、DRL 或 DBV 封装的任何器件。
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