- 制造厂商：TI
- 产品类别：逻辑和电压转换
- 技术类目：缓冲器、驱动器和收发器 - 反向缓冲器和驱动器
- 功能描述：具有漏极开路输出的 2 通道、1.65V 至 5.5V 反相器
- 点击这里打开及下载SN74LVC2G06的技术文档资料
- TI代理渠道，提供当日发货、严格的质量标准，满足您的目标价格
This dual inverter buffer and driver is designed for 1.65-V to 5.5-V VCC operation.
The output of the SN74LVC2G06 device is an open-drain which can be connected to other open-drain outputs to implement active-low, wired-OR, or active-high wired-AND functions. The maximum sink current is 32 mA.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
- Available in the Texas Instruments Package
- Supports 5-V VCC Operation
- Max tpd of 3.4 ns at 3.3 V
- Low Power Consumption, 10-μA Max ICC
- ±24-mA Output Drive at 3.3 V
- Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C
- Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25°C
- Inputs and Open-Drain Outputs Accept Voltages up to 5.5 V
- Ioff Supports Live Insertion, Partial-Power-Down Mode and Back-Drive Protection
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- Supports Down-Translation (5 V to 3.3 V and 3.3 V to 1.8 V)
- ESD Protection Exceeds JESD 22
- 2000-V Human Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
- Technology Family
- LVC
- Supply voltage (Min) (V)
- 1.65
- Supply voltage (Max) (V)
- 5.5
- Number of channels (#)
- 2
- IOL (Max) (mA)
- 32
- IOH (Max) (mA)
- 0
- ICC (Max) (uA)
- 10
- Input type
- Standard CMOS
- Output type
- Open-Drain
- Features
- Very high speed (tpd 5-10ns), Partial power down (Ioff), Over-voltage tolerant inputs
- Rating
- Catalog
SN74LVC2G06的完整型号有：SN74LVC2G06DBVR、SN74LVC2G06DCKR、SN74LVC2G06DCKRG4、SN74LVC2G06DRYR、SN74LVC2G06DSFR、SN74LVC2G06YZPR，以下是这些产品的关键参数及官网采购报价：
SN74LVC2G06DBVR，工作温度：-40 to 125，封装：SOT-23 (DBV)-6，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVC2G06DBVR的批量USD价格：.066（1000+）
SN74LVC2G06DCKR，工作温度：-40 to 125，封装：SC70 (DCK)-6，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：SN，TI官网SN74LVC2G06DCKR的批量USD价格：.086（1000+）
SN74LVC2G06DCKRG4，工作温度：-40 to 125，封装：SC70 (DCK)-6，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVC2G06DCKRG4的批量USD价格：.205（1000+）
SN74LVC2G06DRYR，工作温度：-40 to 125，封装：SON (DRY)-6，包装数量MPQ：5000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVC2G06DRYR的批量USD价格：.132（1000+）
SN74LVC2G06DSFR，工作温度：-40 to 125，封装：SON (DSF)-6，包装数量MPQ：5000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVC2G06DSFR的批量USD价格：.214（1000+）
SN74LVC2G06YZPR，工作温度：-40 to 85，封装：DSBGA (YZP)-6，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：SNAGCU，TI官网SN74LVC2G06YZPR的批量USD价格：.728（1000+）
5-8-LOGIC-EVM — 支持 5 至 8 引脚 DCK、DCT、DCU、DRL 和 DBV 封装的通用逻辑 EVM
灵活的 EVM 设计用于支持具有 5 至 8 引脚数且采用 DCK、DCT、DCU、DRL 或 DBV 封装的任何器件。
