- 制造厂商：TI
- 产品类别：逻辑和电压转换
- 技术类目：逻辑门 - 与非门
- 功能描述：具有漏极开路输出的 2 通道、2 输入、1.65V 至 5.5V 与非门
- 点击这里打开及下载SN74LVC2G38的技术文档资料
- TI代理渠道，提供当日发货、严格的质量标准，满足您的目标价格
The SN74LVC2G38 is designed for 1.65-V to 5.5-V VCC operation.
This device is a dual two-input NAND buffer gate with open-drain outputs. It performs the Boolean function Y = A • B or Y = A + B in positive logic.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
- Available in the Texas Instruments NanoFree Package
- Supports 5-V VCC Operation
- Inputs Accept Voltages to 5.5 V
- Max tpd of 4 ns at 3.3 V
- Low Power Consumption, 10-μA Max ICC
- ±24-mA Output Drive at 3.3 V
- Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C
- Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25°C
- Ioff Supports Live insertion, Partial-Power-Down Mode Operation and Back Drive Protection
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
- Technology Family
- LVC
- Supply voltage (Min) (V)
- 1.65
- Supply voltage (Max) (V)
- 5.5
- Number of channels (#)
- 2
- Inputs per channel
- 2
- IOL (Max) (mA)
- 32
- IOH (Max) (mA)
- 0
- Input type
- Standard CMOS
- Output type
- Open-Drain
- Features
- Partial power down (Ioff), Over-voltage tolerant inputs, Ultra high speed (tpd <5ns)
- Data rate (Max) (Mbps)
- 100
- Rating
- Catalog
SN74LVC2G38的完整型号有：SN74LVC2G38DCTR、SN74LVC2G38DCUR、SN74LVC2G38DCUT、SN74LVC2G38YZPR，以下是这些产品的关键参数及官网采购报价：
SN74LVC2G38DCTR，工作温度：-40 to 125，封装：SM8 (DCT)-8，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVC2G38DCTR的批量USD价格：.196（1000+）
SN74LVC2G38DCUR，工作温度：-40 to 125，封装：VSSOP (DCU)-8，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：SN，TI官网SN74LVC2G38DCUR的批量USD价格：.136（1000+）
SN74LVC2G38DCUT，工作温度：-40 to 125，封装：VSSOP (DCU)-8，包装数量MPQ：250个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVC2G38DCUT的批量USD价格：.378（1000+）
SN74LVC2G38YZPR，工作温度：-40 to 85，封装：DSBGA (YZP)-8，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：SNAGCU，TI官网SN74LVC2G38YZPR的批量USD价格：.238（1000+）
5-8-LOGIC-EVM — 支持 5 至 8 引脚 DCK、DCT、DCU、DRL 和 DBV 封装的通用逻辑 EVM
灵活的 EVM 设计用于支持具有 5 至 8 引脚数且采用 DCK、DCT、DCU、DRL 或 DBV 封装的任何器件。
