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SN74LVC3G04的基本参数
  • 制造厂商:TI
  • 产品类别:逻辑和电压转换
  • 技术类目:缓冲器、驱动器和收发器 - 反向缓冲器和驱动器
  • 功能描述:3 通道、1.65V 至 5.5V 反相器
  • 点击这里打开及下载SN74LVC3G04的技术文档资料
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SN74LVC3G04的产品详情:

This triple inverter is designed for 1.65-V to 5.5-V VCC operation. The SN74LVC3G04 device performs the Boolean function Y = A.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

SN74LVC3G04的优势和特性:
  • Available in the Texas Instruments NanoFree Package
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 4.1 ns at 3.3 V
  • Low Power Consumption, 10-μA Max ICC
  • ±24-mA Output Drive at 3.3 V
  • Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25°C
  • Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
  • Can Be Used as a Down Translator to Translate Inputs From a Max of 5.5 V Down to the VCC Level
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

SN74LVC3G04的参数(英文):
  • Technology Family
  • LVC
  • Supply voltage (Min) (V)
  • 1.65
  • Supply voltage (Max) (V)
  • 5.5
  • Number of channels (#)
  • 3
  • IOL (Max) (mA)
  • 32
  • IOH (Max) (mA)
  • -32
  • ICC (Max) (uA)
  • 10
  • Input type
  • Standard CMOS
  • Output type
  • Push-Pull
  • Features
  • Balanced outputs, Very high speed (tpd 5-10ns), Partial power down (Ioff), Over-voltage tolerant inputs
  • Rating
  • Catalog
SN74LVC3G04具体的完整产品型号参数及价格(美元):

SN74LVC3G04的完整型号有:SN74LVC3G04DCTR、SN74LVC3G04DCUR、SN74LVC3G04DCURG4、SN74LVC3G04DCUT、SN74LVC3G04YZPR,以下是这些产品的关键参数及官网采购报价:

SN74LVC3G04DCTR,工作温度:-40 to 125,封装:SM8 (DCT)-8,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LVC3G04DCTR的批量USD价格:.167(1000+)

SN74LVC3G04DCUR,工作温度:-40 to 125,封装:VSSOP (DCU)-8,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:SN,TI官网SN74LVC3G04DCUR的批量USD价格:.145(1000+)

SN74LVC3G04DCURG4,工作温度:-40 to 125,封装:VSSOP (DCU)-8,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LVC3G04DCURG4的批量USD价格:.245(1000+)

SN74LVC3G04DCUT,工作温度:-40 to 125,封装:VSSOP (DCU)-8,包装数量MPQ:250个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:SN,TI官网SN74LVC3G04DCUT的批量USD价格:.256(1000+)

SN74LVC3G04YZPR,工作温度:-40 to 125,封装:DSBGA (YZP)-8,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:SNAGCU,TI官网SN74LVC3G04YZPR的批量USD价格:.273(1000+)

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SN74LVC3G04的评估套件:

5-8-LOGIC-EVM — 支持 5 至 8 引脚 DCK、DCT、DCU、DRL 和 DBV 封装的通用逻辑 EVM

灵活的 EVM 设计用于支持具有 5 至 8 引脚数且采用 DCK、DCT、DCU、DRL 或 DBV 封装的任何器件。
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