- 制造厂商：TI
- 产品类别：逻辑和电压转换
- 技术类目：缓冲器、驱动器和收发器 - 同相缓冲器和驱动器
- 功能描述：具有漏极开路输出的增强型产品 3 通道、1.65V 至 5.5V 缓冲器
- 点击这里打开及下载SN74LVC3G07-EP的技术文档资料
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This triple buffer/driver is designed for 1.65-V to 5.5-V VCC operation.
The output of the SN74LVC3G07 is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
- Qualified for Automotive Applications
- Supports 5-V VCC Operation
- Max tpd of 6.7 ns at 3.3 V
- Low Power Consumption, 10-μA Max ICC
- ±24-mA Output Drive at 3.3 V
- Input and Open-Drain Output Accepts Voltages up to 5.5 V
- Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C
- Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25°C
- Ioff Supports Partial-Power-Down Mode Operation
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
- SUPPORTS DEFENSE, AEROSPACE, AND MEDICAL APPLICATIONS
- Controlled Baseline
- One Assembly/Test Site
- One Fabrication Site
- Available in Military (–55°C/125°C) Temperature Range(1)
- Extended Product Life Cycle
- Extended Product-Change Notification
- Product Traceability
(1) Additional temperature ranges are available – contact factory
- Technology Family
- LVC
- Supply voltage (Min) (V)
- 1.65
- Supply voltage (Max) (V)
- 5.5
- Number of channels (#)
- 3
- IOL (Max) (mA)
- 32
- ICC (Max) (uA)
- 10
- IOH (Max) (mA)
- -32
- Input type
- Standard CMOS
- Output type
- Open-Drain
- Features
- Very high speed (tpd 5-10ns), Partial power down (Ioff), Over-voltage tolerant inputs
- Rating
- HiRel Enhanced Product
SN74LVC3G07-EP的完整型号有：SN74LVC3G07MDCUREP、V62/09610-01XE，以下是这些产品的关键参数及官网采购报价：
SN74LVC3G07MDCUREP，工作温度：-55 to 125，封装：VSSOP (DCU)-8，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVC3G07MDCUREP的批量USD价格：.767（1000+）
V62/09610-01XE，工作温度：-55 to 125，封装：VSSOP (DCU)-8，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网V62/09610-01XE的批量USD价格：.767（1000+）
SN74LVC3G07MDCUREP，工作温度：-55 to 125，封装：VSSOP (DCU)-8，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVC3G07MDCUREP的批量USD价格：.767（1000+）
V62/09610-01XE，工作温度：-55 to 125，封装：VSSOP (DCU)-8，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网V62/09610-01XE的批量USD价格：.767（1000+）
