The SN54LVC574A octal edge-triggered D-type flip-flop is designed for 2.7-V to 3.6-V V_CC operation, and the SN74LVC574A octal edge-triggered D-type flip-flop is designed for 1.65-V to 3.6-V V_CC operation.

These devices feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

On the positive transition of the clock (CLK) input, the Q outputs are set to the logic levels at the data (D) inputs.

A buffered output-enable (OE)\ input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without interface or pullup components.

OE\ does not affect the internal operations of the flip-flops. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

These devices are fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

To ensure the high-impedance state during power up or power down, OE\ should be tied to V_CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of these devices as translators in a mixed 3.3-V/5-V system environment.

• Operate From 1.65 V to 3.6 V
• Inputs Accept Voltages to 5.5 V
• Specified From -40°C to 85°C, -40°C to 125°C, and -55°C to 125°C
• Max tpd of 7 ns at 3.3 V
• Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C
• Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25°C
• Support Mixed-Mode Signal Operation on All Ports (5-V Input/Output Voltage With 3.3-V VCC)
• Ioff Supports Partial-Power-Down Mode Operation
• Latch-Up Performance Exceeds 250 mA Per JESD 17
• ESD Protection Exceeds JESD 22
  • 2000-V Human-Body Model (A114-A)
  • 200-V Machine Model (A115-A)
  • 1000-V Charged-Device Model (C101)

• Number of channels (#)
• 8
• Technology Family
• LVC
• Supply voltage (Min) (V)
• 1.65
• Supply voltage (Max) (V)
• 3.6
• Input type
• Standard CMOS
• Output type
• 3-State
• Clock Frequency (Max) (MHz)
• 100
• IOL (Max) (mA)
• 24
• IOH (Max) (mA)
• -24
• ICC (Max) (uA)
• 10
• Features
• Balanced outputs, Very high speed (tpd 5-10ns), Over-voltage tolerant inputs, Partial power down (Ioff)

SN74LVC574A的完整型号有：SN74LVC574ADBR、SN74LVC574ADGVR、SN74LVC574ADW、SN74LVC574ADWR、SN74LVC574AN、SN74LVC574ANSR、SN74LVC574APW、SN74LVC574APWR、SN74LVC574APWRG4、SN74LVC574APWT、SN74LVC574ARGYR，以下是这些产品的关键参数及官网采购报价：

SN74LVC574ADBR，工作温度：-40 to 125，封装：SSOP (DB)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVC574ADBR的批量USD价格：.254（1000+）

SN74LVC574ADGVR，工作温度：-40 to 125，封装：TVSOP (DGV)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVC574ADGVR的批量USD价格：.231（1000+）

SN74LVC574ADW，工作温度：-40 to 125，封装：SOIC (DW)-20，包装数量MPQ：25个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVC574ADW的批量USD价格：.431（1000+）

SN74LVC574ADWR，工作温度：-40 to 125，封装：SOIC (DW)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVC574ADWR的批量USD价格：.231（1000+）

SN74LVC574AN，工作温度：-40 to 125，封装：PDIP (N)-20，包装数量MPQ：20个，MSL 等级/回流焊峰值温度：N/A for Pkg Type，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVC574AN的批量USD价格：.312（1000+）

SN74LVC574ANSR，工作温度：-40 to 125，封装：SO (NS)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVC574ANSR的批量USD价格：.254（1000+）

SN74LVC574APW，工作温度：-55 to 125，封装：TSSOP (PW)-20，包装数量MPQ：70个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVC574APW的批量USD价格：.454（1000+）

SN74LVC574APWR，工作温度：-40 to 125，封装：TSSOP (PW)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVC574APWR的批量USD价格：.106（1000+）

SN74LVC574APWRG4，工作温度：-40 to 125，封装：TSSOP (PW)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVC574APWRG4的批量USD价格：.265（1000+）

SN74LVC574APWT，工作温度：-40 to 125，封装：TSSOP (PW)-20，包装数量MPQ：250个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVC574APWT的批量USD价格：.431（1000+）

SN74LVC574ARGYR，工作温度：-40 to 125，封装：VQFN (RGY)-20，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-2-260C-1 YEAR，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVC574ARGYR的批量USD价格：.242（1000+）

14-24-LOGIC-EVM — 支持 14 到 24 引脚 PW、DB、D、DW、NS、DYY 和 DGV 封装的通用逻辑 EVM

该 EVM 设计用于支持采用 14 至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。

14-24-NL-LOGIC-EVM — Generic 14 through 24 pin non-leaded package evaluation module

Flexible EVM designed to support any logic or translation device that has a BQA, BQB, RGY (14-24 pin), RSV, RJW, or RHL package.