- 制造厂商:TI
- 产品类别:逻辑和电压转换
- 技术类目:缓冲器、驱动器和收发器 - 同相缓冲器和驱动器
- 功能描述:具有三态输出的 10 通道、1.65V 至 3.6V 缓冲器
- 点击这里打开及下载SN74LVC827A的技术文档资料
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The SN74LVC827A device is a 10-bit buffer/bus driver is designed for 1.65-V to 3.6-V VCC operation.
- Operates From 1.65 V to 3.6 V
- Inputs Accept Voltages to 5.5 V
- Max tpd of 6.7 ns at 3.3 V
- Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C
- Typical VOHV (Output VOH Undershoot) > 2 V at VCC = 3.3 V, TA = 25°C
- Supports Mixed-Mode Signal Operation on All Ports (5-V Input/Output Voltage With 3.3-V VCC)
- Ioff Supports Live Insertion, Partial-Power- Down Mode, and Back-Drive Protection
- Latch-Up Performance Exceeds 250 mA Per JESD 17
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model
- 200-V Machine Model
- 1000-V Charged-Device Model
- Technology Family
- LVC
- Supply voltage (Min) (V)
- 1.65
- Supply voltage (Max) (V)
- 3.6
- Number of channels (#)
- 10
- IOL (Max) (mA)
- 24
- ICC (Max) (uA)
- 10
- IOH (Max) (mA)
- -24
- Input type
- Standard CMOS
- Output type
- 3-State
- Features
- Balanced outputs, Very high speed (tpd 5-10ns)
- Rating
- Catalog
SN74LVC827A的完整型号有:SN74LVC827ADBR、SN74LVC827ADGVR、SN74LVC827ADW、SN74LVC827ADWR、SN74LVC827APW、SN74LVC827APWR、SN74LVC827APWT,以下是这些产品的关键参数及官网采购报价:
SN74LVC827ADBR,工作温度:-40 to 125,封装:SSOP (DB)-24,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LVC827ADBR的批量USD价格:.556(1000+)
SN74LVC827ADGVR,工作温度:-40 to 125,封装:TVSOP (DGV)-24,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LVC827ADGVR的批量USD价格:.505(1000+)
SN74LVC827ADW,工作温度:-40 to 125,封装:SOIC (DW)-24,包装数量MPQ:25个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LVC827ADW的批量USD价格:.606(1000+)
SN74LVC827ADWR,工作温度:-40 to 125,封装:SOIC (DW)-24,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LVC827ADWR的批量USD价格:.505(1000+)
SN74LVC827APW,工作温度:-40 to 125,封装:TSSOP (PW)-24,包装数量MPQ:60个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LVC827APW的批量USD价格:.606(1000+)
SN74LVC827APWR,工作温度:-40 to 125,封装:TSSOP (PW)-24,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LVC827APWR的批量USD价格:.475(1000+)
SN74LVC827APWT,工作温度:-40 to 125,封装:TSSOP (PW)-24,包装数量MPQ:250个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LVC827APWT的批量USD价格:.606(1000+)
14-24-LOGIC-EVM — 支持 14 到 24 引脚 PW、DB、D、DW、NS、DYY 和 DGV 封装的通用逻辑 EVM
该 EVM 设计用于支持采用 14 至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。