- 制造厂商:TI
- 产品类别:逻辑和电压转换
- 技术类目:缓冲器、驱动器和收发器 - 同相缓冲器和驱动器
- 功能描述:具有 TTL 兼容型 CMOS 输入和三态输出的 8 通道、2.7V 至 3.6V 缓冲器
- 点击这里打开及下载SN74LVT244B的技术文档资料
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This octal buffer and line driver is designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.
The SN74LVT244B is organized as two 4-bit line drivers with separate output-enable (OE)\ inputs. When OE\ is low, the device passes data from the A inputs to the Y outputs. When OE\ is high, the outputs are in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
This device is fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.
- Supports Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
- Supports Unregulated Battery Operation Down to 2.7 V
- Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C
- Ioff and Power-Up 3-State Support Hot Insertion
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
- Technology Family
- LVT
- Supply voltage (Min) (V)
- 2.7
- Supply voltage (Max) (V)
- 3.6
- Number of channels (#)
- 8
- IOL (Max) (mA)
- 64
- ICC (Max) (uA)
- 5000
- IOH (Max) (mA)
- -32
- Input type
- TTL-Compatible CMOS
- Output type
- 3-State
- Features
- Ultra high speed (tpd <5ns), Partial power down (Ioff), Over-voltage tolerant inputs, Power up 3-state
- Rating
- Catalog
SN74LVT244B的完整型号有:SN74LVT244BDBR、SN74LVT244BDW、SN74LVT244BDWR、SN74LVT244BNSR、SN74LVT244BPW、SN74LVT244BPWR、SN74LVT244BRGYR,以下是这些产品的关键参数及官网采购报价:
SN74LVT244BDBR,工作温度:-40 to 85,封装:SSOP (DB)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LVT244BDBR的批量USD价格:.288(1000+)
SN74LVT244BDW,工作温度:-40 to 85,封装:SOIC (DW)-20,包装数量MPQ:25个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LVT244BDW的批量USD价格:.314(1000+)
SN74LVT244BDWR,工作温度:-40 to 85,封装:SOIC (DW)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LVT244BDWR的批量USD价格:.262(1000+)
SN74LVT244BNSR,工作温度:-40 to 85,封装:SO (NS)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LVT244BNSR的批量USD价格:.288(1000+)
SN74LVT244BPW,工作温度:-40 to 85,封装:TSSOP (PW)-20,包装数量MPQ:70个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LVT244BPW的批量USD价格:.314(1000+)
SN74LVT244BPWR,工作温度:-40 to 85,封装:TSSOP (PW)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LVT244BPWR的批量USD价格:.262(1000+)
SN74LVT244BRGYR,工作温度:-40 to 85,封装:VQFN (RGY)-20,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-2-260C-1 YEAR,引脚镀层/焊球材料:NIPDAU,TI官网SN74LVT244BRGYR的批量USD价格:.275(1000+)
14-24-LOGIC-EVM — 支持 14 到 24 引脚 PW、DB、D、DW、NS、DYY 和 DGV 封装的通用逻辑 EVM
该 EVM 设计用于支持采用 14 至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。
14-24-NL-LOGIC-EVM — Generic 14 through 24 pin non-leaded package evaluation module
Flexible EVM designed to support any logic or translation device that has a BQA, BQB, RGY (14-24 pin), RSV, RJW, or RHL package.