The 'LVTH16952 devices are 16-bit registered transceivers designed for low-voltage (3.3-V) V_CC operation, but with the capability to provide a TTL interface to a 5-V system environment.

These devices can be used as two 8-bit transceivers or one 16-bit transceiver. Data on the A or B bus is stored in the registers on the low-to-high transition of the clock (CLKAB or CLKBA) input, provided that the clock-enable (CLKENAB\ or CLKENBA\) input is low. Taking the output-enable (OEAB\ or OEBA\) input low accesses the data on either port.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

When V_CC is between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, OE\ should be tied to V_CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

These devices are fully specified for hot-insertion applications using I_off and power-up 3-state. The I_off circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

The SN54LVTH16952 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74LVTH16952 is characterized for operation from -40°C to 85°C.

• Members of the Texas Instruments WidebusTM Family
• State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low Static-Power Dissipation
• Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
• Support Unregulated Battery Operation Down to 2.7 V
• Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C
• Ioff and Power-Up 3-State Support Hot Insertion
• Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
• Distributed VCC and GND Pins Minimize High-Speed Switching Noise
• Flow-Through Architecture Optimizes PCB Layout
• Latch-Up Performance Exceeds 500 mA Per JESD 17
• ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
• Package Options Include Plastic Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package

Widebus is a trademark of Texas Instruments.

• IOL (Max) (mA)
• 64
• IOH (Max) (mA)
• -64
• Technology Family
• LVT
• Rating
• Catalog
• Operating temperature range (C)
• -40 to 85

SN74LVTH16952的完整型号有：SN74LVTH16952DGGR、SN74LVTH16952DL、SN74LVTH16952DLR，以下是这些产品的关键参数及官网采购报价：

SN74LVTH16952DGGR，工作温度：-40 to 85，封装：TSSOP (DGG)-56，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVTH16952DGGR的批量USD价格：.979（1000+）

SN74LVTH16952DL，工作温度：-40 to 85，封装：SSOP (DL)-56，包装数量MPQ：20个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVTH16952DL的批量USD价格：1.273（1000+）

SN74LVTH16952DLR，工作温度：-40 to 85，封装：SSOP (DL)-56，包装数量MPQ：1000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVTH16952DLR的批量USD价格：1.077（1000+）

SN74LVTH16952DGGR，工作温度：-40 to 85，封装：TSSOP (DGG)-56，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVTH16952DGGR的批量USD价格：.979（1000+）

SN74LVTH16952DL，工作温度：-40 to 85，封装：SSOP (DL)-56，包装数量MPQ：20个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVTH16952DL的批量USD价格：1.273（1000+）

SN74LVTH16952DLR，工作温度：-40 to 85，封装：SSOP (DL)-56，包装数量MPQ：1000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVTH16952DLR的批量USD价格：1.077（1000+）