This octal flip-flop is designed specifically for low-voltage (3.3-V) V_CC operation, but with the capability to provide a TTL interface to a 5-V system environment.

The eight flip-flops of the SN74LVTH574 are edge-triggered D-type flip-flops. On the positive transition of the clock (CLK) input, the Q outputs are set to the logic levels set up at the data (D) inputs.

A buffered output-enable (OE)\ input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without need for interface or pullup components.

OE\ does not affect the internal operations of the flip-flops. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

To ensure the high-impedance state during power up or power down, OE\ should be tied to V_CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended.

This device is fully specified for hot-insertion applications using I_off and power-up 3-state. The I_off circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

• Controlled Baseline
  • One Assembly/Test Site, One Fabrication Site
• Enhanced Diminishing Manufacturing Sources (DMS) Support
• Enhanced Product-Change Notification
• Qualification Pedigree
• Supports Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
• Supports Unregulated Battery Operation Down to 2.7 V
• Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C
• Ioff and Power-Up 3-State Support Hot Insertion
• Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
• Latch-Up Performance Exceeds 500 mA Per JESD 17
• ESD Protection Exceeds JESD 22
  • 2000-V Human-Body Model (A114-A)
  • 200-V Machine Model (A115-A)

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

• Number of channels (#)
• 8
• Technology Family
• LVT
• Supply voltage (Min) (V)
• 2.7
• Supply voltage (Max) (V)
• 3.6
• Input type
• TTL-Compatible CMOS
• Output type
• 3-State
• Clock Frequency (Max) (MHz)
• 150
• IOL (Max) (mA)
• 64
• IOH (Max) (mA)
• -32
• ICC (Max) (uA)
• 5000
• Features
• Ultra high speed (tpd <5ns), Over-voltage tolerant inputs, Partial power down (Ioff), Power up 3-state, Bus-hold

SN74LVTH574-EP的完整型号有：SN74LVTH574IPWREP、V62/04679-01XE，以下是这些产品的关键参数及官网采购报价：

SN74LVTH574IPWREP，工作温度：-40 to 85，封装：TSSOP (PW)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVTH574IPWREP的批量USD价格：1.085（1000+）

V62/04679-01XE，工作温度：-40 to 85，封装：TSSOP (PW)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网V62/04679-01XE的批量USD价格：1.085（1000+）

SN74LVTH574IPWREP，工作温度：-40 to 85，封装：TSSOP (PW)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVTH574IPWREP的批量USD价格：1.085（1000+）

V62/04679-01XE，工作温度：-40 to 85，封装：TSSOP (PW)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网V62/04679-01XE的批量USD价格：1.085（1000+）