These bus transceivers and registers are designed specifically for low-voltage (3.3-V) V_CC operation, but with the capability to provide a TTL interface to a 5-V system environment.

The ’LVTH652 devices consist of bus-transceiver circuits, D-type flip-flops, and control circuitry arranged for multiplexed transmission of data directly from the data bus or from the internal storage registers.

Output-enable (OEAB and OEBA\) inputs are provided to control the transceiver functions. Select-control (SAB and SBA) inputs are provided to select whether real-time or stored data is transferred. The circuitry used for select control eliminates the typical decoding glitch that occurs in a multiplexer during the transition between real-time and stored data. A low input selects real-time data and a high input selects stored data. Figure 1 illustrates the four fundamental bus-management functions that can be performed with the ’LVTH652 devices.

Data on the A or B data bus, or both, can be stored in the internal D-type flip-flops by low-to-high transitions at the appropriate clock (CLKAB or CLKBA) inputs, regardless of the select- or enable-control pins. When SAB and SBA are in the real-time transfer mode, it is possible to store data without using the internal D-type flip-flops by simultaneously enabling OEAB and OEBA\. In this configuration, each output reinforces its input; therefore, when all other data sources to the two sets of bus lines are at high impedance, each set of bus lines remains at its last state.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended.

When V_CC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, OE\ should be tied to V_CC through a pullup resistor and OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sinking/current-sourcing capability of the driver.

This device is fully specified for hot-insertion applications using I_off and power-up 3-state. The I_off circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

• Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
• Support Unregulated Battery Operation Down to 2.7 V
• Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C
• Ioff and Power-Up 3-State Support Hot Insertion
• Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
• Latch-Up Performance Exceeds 500 mA Per JESD 17
• ESD Protection Exceeds JESD 22
  • 2000-V Human-Body Model (A114-A)
  • 200-V Machine Model (A115-A)

• IOL (Max) (mA)
• 64
• IOH (Max) (mA)
• -64
• Technology Family
• LVT
• Rating
• Catalog
• Operating temperature range (C)
• -40 to 85

SN74LVTH652的完整型号有：SN74LVTH652DW、SN74LVTH652PW、SN74LVTH652PWR，以下是这些产品的关键参数及官网采购报价：

SN74LVTH652DW，工作温度：-40 to 85，封装：SOIC (DW)-24，包装数量MPQ：25个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVTH652DW的批量USD价格：.815（1000+）

SN74LVTH652PW，工作温度：-40 to 85，封装：TSSOP (PW)-24，包装数量MPQ：60个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVTH652PW的批量USD价格：.978（1000+）

SN74LVTH652PWR，工作温度：-40 to 85，封装：TSSOP (PW)-24，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVTH652PWR的批量USD价格：.815（1000+）

14-24-LOGIC-EVM — 支持 14 到 24 引脚 PW、DB、D、DW、NS、DYY 和 DGV 封装的通用逻辑 EVM

该 EVM 设计用于支持采用 14 至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。