- 制造厂商:TI
- 产品类别:逻辑和电压转换
- 技术类目:专用逻辑 IC - 总线终端阵列
- 功能描述:16 位肖特基势垒二极管总线终端阵列
- 点击这里打开及下载SN74S1053的技术文档资料
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This Schottky barrier diode bus-termination array is designed to reduce reflection noise on memory bus lines. This device consists of a 16-bit high-speed Schottky diode array suitable for clamping to VCC and/or GND.
The SN74S1053 is characterized for operation from 0°C to 70°C.
- Designed to Reduce Reflection Noise
- Repetitive Peak Forward Current to 200mA
- 16-Bit Array Structure Suited for Bus-Oriented Systems
- Package Options Include Plastic Small-Outline Packages and Standard Plastic 300-mil DIPs
- Bits (#)
- 16
- Supply voltage (Min) (V)
- 4.75
- Supply voltage (Max) (V)
- 5.25
SN74S1053的完整型号有:SN74S1053DBR、SN74S1053DW、SN74S1053DWR、SN74S1053N、SN74S1053NSR、SN74S1053PW、SN74S1053PWR,以下是这些产品的关键参数及官网采购报价:
SN74S1053DBR,工作温度:0 to 70,封装:SSOP (DB)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74S1053DBR的批量USD价格:1.929(1000+)
SN74S1053DW,工作温度:0 to 70,封装:SOIC (DW)-20,包装数量MPQ:25个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74S1053DW的批量USD价格:1.654(1000+)
SN74S1053DWR,工作温度:0 to 70,封装:SOIC (DW)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74S1053DWR的批量USD价格:1.378(1000+)
SN74S1053N,工作温度:0 to 70,封装:PDIP (N)-20,包装数量MPQ:20个,MSL 等级/回流焊峰值温度:N/A for Pkg Type,引脚镀层/焊球材料:NIPDAU,TI官网SN74S1053N的批量USD价格:1.585(1000+)
SN74S1053NSR,工作温度:0 to 70,封装:SO (NS)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74S1053NSR的批量USD价格:1.516(1000+)
SN74S1053PW,工作温度:0 to 70,封装:TSSOP (PW)-20,包装数量MPQ:70个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74S1053PW的批量USD价格:1.654(1000+)
SN74S1053PWR,工作温度:0 to 70,封装:TSSOP (PW)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74S1053PWR的批量USD价格:1.378(1000+)
14-24-LOGIC-EVM — 支持 14 到 24 引脚 PW、DB、D、DW、NS、DYY 和 DGV 封装的通用逻辑 EVM
该 EVM 设计用于支持采用 14 至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。