- 制造厂商:TI
- 产品类别:逻辑和电压转换
- 技术类目:缓冲器、驱动器和收发器 - 通用收发器
- 功能描述:具有三态输出的 8 位通用总线收发器和两个 1 位总线收发器
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The SN74VMEH22501 8-bit universal bus transceiver has two integral 1-bit three-wire bus transceivers and is designed for 3.3-V VCC operation with 5-V tolerant inputs. The UBT™ transceiver allows transparent, latched, and flip-flop modes of data transfer, and the separate LVTTL input and outputs on the bus transceivers provide a feedback path for control and diagnostics monitoring. This device provides a high-speed interface between cards operating at LVTTL logic levels and VME64, VME64x, or VME320(1) backplane topologies.
High-speed backplane operation is a direct result of the improved OEC™ circuitry and high drive that has been designed and tested into the VME64x backplane model. The B-port I/Os are optimized for driving large capacitive loads and include pseudo-ETL input thresholds (½ VCC ± 50 mV) for increased noise immunity. These specifications support the 2eVME protocols in VME64x (ANSI/VITA 1.1) and 2eSST protocols in VITA 1.5. With proper design of a 21-slot VME system, a designer can achieve 320-Mbyte transfer rates on linear backplanes and, possibly, 1-Gbyte transfer rates on the VME320 backplane.
All inputs and outputs are 5-V tolerant and are compatible with TTL and 5-V CMOS inputs.
Active bus-hold circuitry holds unused or undriven 3A-port inputs at a valid logic state. Bus-hold circuitry is not provided on 1A or 2A inputs, any B-port input, or any control input. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended.
This device is fully specified for live-insertion applications using Ioff, power-up 3-state, and BIAS VCC. The Ioff circuitry prevents damaging current to backflow through the device when it is powered off/on. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. The BIAS VCC circuitry precharges and preconditions the B-port input/output connections, preventing disturbance of active data on the backplane during card insertion or removal, and permits true live-insertion capability.
When VCC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, output-enable (OE and OEBY) inputs should be tied to VCC through a pullup resistor and output-enable (OEAB) inputs should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the drive capability of the device connected to this input.
- Member of the Texas Instruments Widebus? Family
- UBT? Transceiver Combines D-Type Latches and D-Type Flip-Flops for Operation in Transparent, Latched, or ClockedModes
- OEC? Circuitry Improves Signal Integrity and Reduces Electromagnetic Interference (EMI)
- Compliant With VME64, 2eVME, and 2eSST Protocol
- Bus Transceiver Split LVTTL Port Provides a Feedback Path for Control and Diagnostics Monitoring
- I/O Interfaces Are 5-VTolerant
- B-Port Outputs (–48mA/64mA)
- Y and A-Port Outputs (–12mA/12mA)
- Ioff, Power-Up 3-State, and BIAS VCC Support LiveInsertion
- Bus Hold on 3A-Port Data Inputs
- 26- Equivalent Series Resistor on 3APorts and YOutputs
- Flow-Through Architecture Facilitates Printed Circuit Board Layout
- Distributed VCC and GND Pins Minimize High-Speed Switching Noise
- Latch-Up Performance Exceeds 100 mA Per JESD 78, ClassII
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
MicroStar is a trademark of Texas Instruments. (1) VME320 is a patented backplane construction by Arizona Digital, Inc.
- IOL (Max) (mA)
- 12
- IOH (Max) (mA)
- -24
- Technology Family
- VME
- Rating
- Catalog
- Operating temperature range (C)
- 0 to 85
SN74VMEH22501的完整型号有:SN74VMEH22501DGG、SN74VMEH22501DGGR、SN74VMEH22501DGVR,以下是这些产品的关键参数及官网采购报价:
SN74VMEH22501DGG,工作温度:0 to 85,封装:TSSOP (DGG)-48,包装数量MPQ:40个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74VMEH22501DGG的批量USD价格:USD(1000+)
SN74VMEH22501DGGR,工作温度:0 to 85,封装:TSSOP (DGG)-48,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74VMEH22501DGGR的批量USD价格:2.391(1000+)
SN74VMEH22501DGVR,工作温度:0 to 85,封装:TVSOP (DGV)-48,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74VMEH22501DGVR的批量USD价格:2.391(1000+)
SN74VMEH22501DGG,工作温度:0 to 85,封装:TSSOP (DGG)-48,包装数量MPQ:40个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74VMEH22501DGG的批量USD价格:USD(1000+)
SN74VMEH22501DGGR,工作温度:0 to 85,封装:TSSOP (DGG)-48,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74VMEH22501DGGR的批量USD价格:2.391(1000+)
SN74VMEH22501DGVR,工作温度:0 to 85,封装:TVSOP (DGV)-48,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74VMEH22501DGVR的批量USD价格:2.391(1000+)