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SN74VMEH22501A-EP的基本参数
  • 制造厂商:TI
  • 产品类别:逻辑和电压转换
  • 技术类目:缓冲器、驱动器和收发器 - 通用收发器
  • 功能描述:增强型产品 8 位通用总线收发器和 2 个 1 位总线收发器
  • 点击这里打开及下载SN74VMEH22501A-EP的技术文档资料
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SN74VMEH22501A-EP的产品详情:

The SN74VMEH22501A-EP 8-bit universal bus transceiver has two integral 1-bit three-wire bus transceivers and is designed for 3.3-V VCC operation with 5-V tolerant inputs. The UBT transceiver allows transparent, latched, and flip-flop modes of data transfer, and the separate LVTTL input and outputs on the bus transceivers provide a feedback path for control and diagnostics monitoring. This device provides a high-speed interface between cards operating at LVTTL logic levels and VME64, VME64x, or VME320(2) backplane topologies.

The SN74VMEH22501A-EP device is pin-for-pin compatible to the SN74VMEH22501 device (SCES357), but operates at a wider operating temperature range.

High-speed backplane operation is a direct result of the improved OEC circuitry and high drive that has been designed and tested into the VME64x backplane model. The B-port I/Os are optimized for driving large capacitive loads and include pseudo-ETL input thresholds (? VCC ±50 mV) for increased noise immunity. These specifications support the 2eVME protocols in VME64x (ANSI/VITA 1.1) and 2eSST protocols in VITA 1.5.

With proper design of a 21-slot VME system, a designer can achieve 320-MB transfer rates on linear backplanes and, possibly, 1-GB transfer rates on the VME320 backplane.

All inputs and outputs are 5-V tolerant and are compatible with TTL and 5-V CMOS inputs.

Active bus-hold circuitry holds unused or undriven 3A-port inputs at a valid logic state. Bus-hold circuitry is not provided on 1A or 2A inputs, any B-port input, or any control input. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended.

This device is fully specified for live-insertion applications using Ioff, power-up 3-state, and BIAS VCC. The Ioff circuitry prevents damaging current to backflow through the device when it is powered off/on. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. The BIAS VCC circuitry precharges and preconditions the B-port input/output connections, preventing disturbance of active data on the backplane during card insertion or removal, and permits true live-insertion capability.

When VCC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, output-enable (OE and OEBY) inputs should be tied to VCC through a pullup resistor and output-enable (OEAB) inputs should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the drive capability of the device connected to this input.

SN74VMEH22501A-EP的优势和特性:
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree(1)
  • Member of the Texas Instruments Widebus Family
  • UBT Transceiver Combines D-Type Latches and D-Type Flip-Flops for Operation in Transparent, Latched, or Clocked Modes
  • OEC Circuitry Improves Signal Integrity and Reduces Electromagnetic Interference (EMI)
  • Compliant With VME64, 2eVME, and 2eSST Protocols Validated at TA = -40°C to 85°C
  • Bus Transceiver Split LVTTL Port Provides a Feedback Path for Control and Diagnostics Monitoring
  • I/O Interfaces are 5-V Tolerant
  • B-Port Outputs (-48 mA/64 mA)
  • Y and A-Port Outputs (-12 mA/12 mA)
  • Ioff, Power-Up 3-State, and BIAS VCC Support Live Insertion
  • Bus Hold on 3A-Port Data Inputs
  • 26-? Equivalent Series Resistor on 3A Ports and Y Outputs
  • Flow-Through Architecture Facilitates Printed Circuit Board Layout
  • Distributed VCC and GND Pins Minimize High-Speed Switching Noise
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
SN74VMEH22501A-EP的参数(英文):
  • IOL (Max) (mA)
  • 12
  • IOH (Max) (mA)
  • -24
  • Technology Family
  • VME
  • Rating
  • HiRel Enhanced Product
  • Operating temperature range (C)
  • -40 to 85, -55 to 125
SN74VMEH22501A-EP具体的完整产品型号参数及价格(美元):

SN74VMEH22501A-EP的完整型号有:CVMEH22501AIDGGREP、CVMEH22501AIDGVREP、CVMEH22501AMDGGREP、V62/05606-01XE、V62/05606-01YE、V62/05606-02XE,以下是这些产品的关键参数及官网采购报价:

CVMEH22501AIDGGREP,工作温度:-40 to 85,封装:TSSOP (DGG)-48,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网CVMEH22501AIDGGREP的批量USD价格:3.696(1000+)

CVMEH22501AIDGVREP,工作温度:-40 to 85,封装:TVSOP (DGV)-48,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网CVMEH22501AIDGVREP的批量USD价格:3.696(1000+)

CVMEH22501AMDGGREP,工作温度:-55 to 125,封装:TSSOP (DGG)-48,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网CVMEH22501AMDGGREP的批量USD价格:3.696(1000+)

V62/05606-01XE,工作温度:-40 to 85,封装:TSSOP (DGG)-48,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网V62/05606-01XE的批量USD价格:3.696(1000+)

V62/05606-01YE,工作温度:-40 to 85,封装:TVSOP (DGV)-48,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网V62/05606-01YE的批量USD价格:3.696(1000+)

V62/05606-02XE,工作温度:-55 to 125,封装:TSSOP (DGG)-48,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网V62/05606-02XE的批量USD价格:3.696(1000+)

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SN74VMEH22501A-EP的评估套件:

CVMEH22501AIDGGREP,工作温度:-40 to 85,封装:TSSOP (DGG)-48,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网CVMEH22501AIDGGREP的批量USD价格:3.696(1000+)

CVMEH22501AIDGVREP,工作温度:-40 to 85,封装:TVSOP (DGV)-48,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网CVMEH22501AIDGVREP的批量USD价格:3.696(1000+)

CVMEH22501AMDGGREP,工作温度:-55 to 125,封装:TSSOP (DGG)-48,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网CVMEH22501AMDGGREP的批量USD价格:3.696(1000+)

V62/05606-01XE,工作温度:-40 to 85,封装:TSSOP (DGG)-48,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网V62/05606-01XE的批量USD价格:3.696(1000+)

V62/05606-01YE,工作温度:-40 to 85,封装:TVSOP (DGV)-48,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网V62/05606-01YE的批量USD价格:3.696(1000+)

V62/05606-02XE,工作温度:-55 to 125,封装:TSSOP (DGG)-48,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网V62/05606-02XE的批量USD价格:3.696(1000+)

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