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TLC556的基本参数
  • 制造厂商:TI
  • 产品类别:时钟和计时
  • 技术类目:实时时钟 (RTC) 和计时器
  • 功能描述:15V 双路 LinCMOS 计时器
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TLC556的产品详情:

The TLC556 series are monolithic timing circuits fabricated using the TI LinCMOSTM process, which provides full compatibility with CMOS, TTL, and MOS logic and operates at frequencies up to 2MHz. Accurate time delays and oscillations are possible with smaller, less-expensive timing capacitors than the NE556 because of the high input impedance. Power consumption is low across the full range of power supply voltages.

Like the NE556, the TLC556 has a trigger level approximately one-third of the supply voltage and

a threshold level approximately two-thirds of the supply voltage. These levels can be altered by use of the control voltage terminal. When the trigger input falls below the trigger level, the flip-flop is set and the output goes high. If the trigger input is above the trigger level and the threshold input is above the threshold level, the flip-flop is reset and the output is low. The reset input can override all other inputs and can be used to initiate a new timing cycle. If the reset input is low, the flip-flop is reset and the output is low. Whenever the output is low, a low-impedance path is provided between the discharge terminal and ground.

While the CMOS output is capable of sinking over 100 mA and sourcing over 10 mA, the TLC556 exhibits greatly reduced supply-current spikes during output transitions. This minimizes the need for the large decoupling capacitors required by the NE556.

These devices have internal electrostatic-discharge (ESD) protection circuits that prevent catastrophic failures at voltages up to 2000 V as tested under MIL-STD-883C, Method 3015. However, care should be exercised in handling these devices, as exposure to ESD may result in degradation of the device parametric performance.

All unused inputs should be tied to an appropriate logic level to prevent false triggering.

The TLC556C is characterized for operation from 0°C to 70°C. The TLC556I is characterized for operation from -40°C to 85°C. The TLC556M is characterized for operation over the full military temperature range of -55°C to 125°C

TLC556的优势和特性:
  • Very Low Power Consumption...2 mW Typ at VDD = 5 V
  • Capable of Operation in Astable Mode
  • CMOS Output Capable of Swinging Rail to Rail
  • High Output-Current Capability Sink 100 mA Typ Source 10 mA Typ
  • Output Fully Compatible With CMOS, TTL, and MOS
  • Low Supply Current Reduces Spikes During Output Transitions
  • Single-Supply Operation From 2 V to 15 V
  • Functionally interchangeable With the NE556; Has Same Pinout

LinCMOS is a trademark of Texas Instruments Incorporated.

TLC556的参数(英文):
  • Iq (Typ) (uA)
  • 130
  • Rating
  • Catalog
  • Operating temperature range (C)
  • -40 to 85, -55 to 125, 0 to 70
  • Supply voltage (Max) (V)
  • 15
  • Supply voltage (Min) (V)
  • 2
TLC556具体的完整产品型号参数及价格(美元):

TLC556的完整型号有:TLC556CD、TLC556CDR、TLC556CN、TLC556ID、TLC556IDR、TLC556IN、TLC556MD、TLC556MDG4、TLC556MDR,以下是这些产品的关键参数及官网采购报价:

TLC556CD,工作温度:0 to 70,封装:SOIC (D)-14,包装数量MPQ:50个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网TLC556CD的批量USD价格:0.52(1000+)

TLC556CDR,工作温度:PropertyValue,封装:SOIC (D)-14,包装数量MPQ:2500个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网TLC556CDR的批量USD价格:0.395(1000+)

TLC556CN,工作温度:PropertyValue,封装:PDIP (N)-14,包装数量MPQ:25个,MSL 等级/回流焊峰值温度:N/A for Pkg Type,引脚镀层/焊球材料:NIPDAU,TI官网TLC556CN的批量USD价格:0.498(1000+)

TLC556ID,工作温度:PropertyValue,封装:SOIC (D)-14,包装数量MPQ:50个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网TLC556ID的批量USD价格:0.563(1000+)

TLC556IDR,工作温度:-40 to 85,封装:SOIC (D)-14,包装数量MPQ:2500个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网TLC556IDR的批量USD价格:0.435(1000+)

TLC556IN,工作温度:PropertyValue,封装:PDIP (N)-14,包装数量MPQ:25个,MSL 等级/回流焊峰值温度:N/A for Pkg Type,引脚镀层/焊球材料:NIPDAU,TI官网TLC556IN的批量USD价格:0.541(1000+)

TLC556MD,工作温度:-55 to 125,封装:SOIC (D)-14,包装数量MPQ:50个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网TLC556MD的批量USD价格:0.797(1000+)

TLC556MDG4,工作温度:PropertyValue,封装:SOIC (D)-14,包装数量MPQ:50个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网TLC556MDG4的批量USD价格:0.862(1000+)

TLC556MDR,工作温度:-55 to 125,封装:SOIC (D)-14,包装数量MPQ:2500个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网TLC556MDR的批量USD价格:0.71(1000+)

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TLC556的评估套件:

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