The TMS320C6745/6747 device is a low-power digital signal processor based on a TMS320C674x DSP core. It consumes significantly lower power than other members of the TMS320C6000™ platform of DSPs.

The TMS320C6745/6747 device enables original-equipment manufacturers (OEMs) and original-design manufacturers (ODMs) to quickly bring to market devices featuring high processing performance .

The TMS320C6745/6747 DSP core uses a two-level cache-based architecture. The Level 1 program cache (L1P) is a 32-KB direct mapped cache and the Level 1 data cache (L1D) is a 32-KB 2-way set-associative cache. The Level 2 program cache (L2P) consists of a 256-KB memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two. Although the DSP L2 is accessible by other hosts in the system, an additional 128KB of RAM shared memory (TMS320C6747 only) is available for use by other hosts without affecting DSP performance.

The peripheral set includes: a 10/100 Mbps Ethernet MAC (EMAC) with a management data input/output (MDIO) module; two I²C Bus interfaces; 3 multichannel audio serial ports (McASPs) with 16/9 serializers and FIFO buffers; two 64-bit general-purpose timers each configurable (one configurable as watchdog); a configurable 16-bit host-port interface (HPI) [TMS320C6747 only]; up to 8 banks of 16 pins of general-purpose input/output (GPIO) with programmable interrupt/event generation modes, multiplexed with other peripherals; 3 UART interfaces (one with both RTS and CTS); three enhanced high-resolution pulse width modulator (eHRPWM) peripherals; three 32-bit enhanced capture (eCAP) module peripherals which can be configured as 3 capture inputs or 3 auxiliary pulse width modulator (APWM) outputs; two 32-bit enhanced quadrature encoded pulse (eQEP) peripherals; and 2 external memory interfaces: an asynchronous and SDRAM external memory interface (EMIFA) for slower memories or peripherals, and a higher speed memory interface (EMIFB) for SDRAM.

The Ethernet Media Access Controller (EMAC) provides an efficient interface between the TMS320C6745/6747 device and the network. The EMAC supports both 10Base-T and 100Base-TX, or 10 Mbps and 100 Mbps in either half- or full-duplex mode. Additionally, an MDIO interface is available for PHY configuration.

The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each of the peripherals, see the related sections later in this document and the associated peripheral reference guides.

• Software Support
  • TI DSP/BIOS?
  • Chip Support Library and DSP Library
• 375- and 456-MHz TMS320C674x VLIW DSP
• C674x Instruction Set Features
  • Superset of the C67x+ and C64x+ ISAs
  • Up to 3648 MIPS and 2736 MFLOPS C674x
  • Byte-Addressable (8-, 16-, 32-, and 64-Bit Data)
  • 8-Bit Overflow Protection
  • Bit-Field Extract, Set, Clear
  • Normalization, Saturation, Bit-Counting
  • Compact 16-Bit Instructions
• C674x Two-Level Cache Memory Architecture
  • 32KB of L1P Program RAM/Cache
  • 32KB of L1D Data RAM/Cache
  • 256KB of L2 Unified Mapped RAM/Cache
  • Flexible RAM/Cache Partition (L1 and L2)
• Enhanced Direct Memory Access Controller 3 (EDMA3):
  • 2 Transfer Controllers
  • 32 Independent DMA Channels
  • 8 Quick DMA Channels
  • Programmable Transfer Burst Size
• TMS320C674x Fixed- and Floating-Point VLIW DSP Core
  • Load-Store Architecture with Nonaligned Support
  • 64 General-Purpose Registers (32-Bit)
  • Six ALU (32- and 40-Bit) Functional Units
    • Supports 32-Bit Integer, SP (IEEE Single Precision/32-Bit) and DP (IEEE Double Precision/64-Bit) Floating Point
    • Supports up to Four SP Additions Per Clock, Four DP Additions Every 2 Clocks
    • Supports up to Two Floating-Point (SP or DP) Reciprocal Approximation (RCPxP) and Square-Root Reciprocal Approximation (RSQRxP) Operations Per Cycle
  • Two Multiply Functional Units
    • Mixed-Precision IEEE Floating Point Multiply Supported up to:
      • 2 SP x SP -> SP Per Clock
      • 2 SP x SP -> DP Every Two Clocks
      • 2 SP x DP -> DP Every Three Clocks
      • 2 DP x DP -> DP Every Four Clocks
    • Fixed-Point Multiply Supports Two 32 x 32-Bit Multiplies, Four 16 x 16-Bit Multiplies, or Eight 8 x 8-Bit Multiplies per Clock Cycle, and Complex Multiples
  • Instruction Packing Reduces Code Size
  • All Instructions Conditional
  • Hardware Support for Modulo Loop Operation
  • Protected Mode Operation
  • Exceptions Support for Error Detection and Program Redirection
• 128KB of RAM Shared Memory (TMS320C6747 Only)
• 3.3-V LVCMOS I/Os (Except for USB Interfaces)
• Two External Memory Interfaces:
  • EMIFA
    • NOR (8- or 16-Bit-Wide Data)
    • NAND (8- or 16-Bit-Wide Data)
    • 16-Bit SDRAM with 128-MB Address Space (TMS320C6747 Only)
  • EMIFB
    • 32-Bit or 16-Bit SDRAM with 256-MB Address Space (TMS320C6747)
    • 16-Bit SDRAM with 128-MB Address Space (TMS320C6745)
• Three Configurable 16550-Type UART Modules:
  • UART0 with Modem Control Signals
  • Autoflow Control Signals (CTS, RTS) on UART0 Only
  • 16-Byte FIFO
  • 16x or 13x Oversampling Option
• LCD Controller (TMS320C6747 Only)
• Two Serial Peripheral Interfaces (SPIs) Each with One Chip Select
• Multimedia Card (MMC)/Secure Digital (SD) Card Interface with Secure Data I/O (SDIO)
• Two Master and Slave Inter-Integrated Circuit (I2C Bus?)
• One Host-Port Interface (HPI) with 16-Bit-Wide Muxed Address/Data Bus for High Bandwidth (TMS320C6747 Only)
• Programmable Real-Time Unit Subsystem (PRUSS)
  • Two Independent Programmable Realtime Unit (PRU) Cores
    • 32-Bit Load and Store RISC Architecture
    • 4KB of Instruction RAM per Core
    • 512 Bytes of Data RAM per Core
    • PRUSS can be Disabled via Software to Save Power
  • Standard Power-Management Mechanism
    • Clock Gating
    • Entire Subsystem Under a Single PSC Clock Gating Domain
  • Dedicated Interrupt Controller
  • Dedicated Switched Central Resource
• USB 1.1 OHCI (Host) with Integrated PHY (USB1) (TMS320C6747 Only)
• USB 2.0 OTG Port with Integrated PHY (USB0)
  • USB 2.0 High- and Full-Speed Client (TMS320C6747)
  • USB 2.0 Full-Speed Client (TMS320C6745)
  • USB 2.0 High-, Full-, and Low-Speed Host (TMS320C6747)
  • USB 2.0 Full- and Low-Speed Host (TMS320C6745)
  • High-Speed Functionality Available on TMS320C6747 Device Only
  • End Point 0 (Control)
  • End Points 1,2,3,4 (Control, Bulk, Interrupt or ISOC) RX and TX
• Three Multichannel Audio Serial Ports (McASPs):
  • TMS320C6747 Supports 3 McASPs
  • TMS320C6745 Supports 2 McASPs
  • Six Clock Zones and 28 Serial Data Pins
  • Supports TDM, I2S, and Similar Formats
  • DIT-Capable (McASP2)
  • FIFO Buffers for Transmit and Receive
• 10/100 Mbps Ethernet MAC (EMAC):
  • IEEE 802.3 Compliant (3.3-V I/O Only)
  • RMII Media-Independent Interface
  • Management Data I/O (MDIO) Module
• Real-Time Clock with 32-kHz Oscillator and Separate Power Rail (TMS320C6747 Only)
• One 64-Bit General-Purpose Timer (Configurable as Two 32-Bit Timers)
• One 64-Bit General-Purpose Watchdog Timer (Configurable as Two 32-Bit General-Purpose Timers)
• Three Enhanced Pulse Width Modulators (eHRPWMs):
  • Dedicated 16-Bit Time-Base Counter with Period and Frequency Control
  • 6 Single Edge, 6 Dual Edge Symmetric, or 3 Dual Edge Asymmetric Outputs
  • Dead-Band Generation
  • PWM Chopping by High-Frequency Carrier
  • Trip Zone Input
• Three 32-Bit Enhanced Capture (eCAP) Modules:
  • Configurable as 3 Capture Inputs or 3 Auxiliary Pulse Width Modulator (APWM) Outputs
  • Single-Shot Capture of up to Four Event Time-Stamps
• Two 32-Bit Enhanced Quadrature Encoder Pulse (eQEP) Modules
• TMS320C6747 Device:
  • 256-Ball Pb-Free Plastic Ball Grid Array (PBGA) [ZKB Suffix], 1.0-mm Ball Pitch
• TMS320C6745 Device:
  • 176-pin PowerPAD? Plastic Quad Flat Pack [PTP suffix], 0.5-mm Pin Pitch
• Commercial, Industrial, Extended, or Automotive Temperature

• DSP
• 1 C674x
• DSP MHz (Max)
• 375, 456
• CPU
• 32-/64-bit
• Operating system
• SYS/BIOS
• Ethernet MAC
• 10/100
• Rating
• Catalog
• Operating temperature range (C)
• -40 to 105, -40 to 125, -40 to 90, 0 to 90

TMS320C6747的完整型号有：TMS320C6747DZKB3、TMS320C6747DZKB4、TMS320C6747DZKBA3、TMS320C6747DZKBD4、TMS320C6747DZKBT3，以下是这些产品的关键参数及官网采购报价：

TMS320C6747DZKB3，工作温度：0 to 90，封装：BGA (ZKB)-256，包装数量MPQ：90个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：SNAGCU，TI官网TMS320C6747DZKB3的批量USD价格：8.976（1000+）

TMS320C6747DZKB4，工作温度：PropertyValue，封装：BGA (ZKB)-256，包装数量MPQ：90个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：SNAGCU，TI官网TMS320C6747DZKB4的批量USD价格：10.771（1000+）

TMS320C6747DZKBA3，工作温度：-40 to 105，封装：BGA (ZKB)-256，包装数量MPQ：90个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：Call TI，TI官网TMS320C6747DZKBA3的批量USD价格：10.771（1000+）

TMS320C6747DZKBD4，工作温度：-40 to 90，封装：BGA (ZKB)-256，包装数量MPQ：90个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：Call TI，TI官网TMS320C6747DZKBD4的批量USD价格：12.118（1000+）

TMS320C6747DZKBT3，工作温度：-40 to 125，封装：BGA (ZKB)-256，包装数量MPQ：90个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：SNAGCU，TI官网TMS320C6747DZKBT3的批量USD价格：10.771（1000+）

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适用于 C6747、C6745 和 C6743 的处理器 SDK 包括 TI-RTOS 操作系统的各种支持。

RTOS 亮点：

• TI-RTOS 内核，一种用于 TI 器件的轻量级实时嵌入式操作系统
• 芯片支持库、驱动程序和基本的板级支持实用程序
• 经过优化的 C674x 算法库

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如需了解有关 Vocal Technologies 的更多信息，请访问 https://www.vocal.com。 发件人： VOCAL Technologies, Ltd.

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