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TMS37157的基本参数
  • 制造厂商:TI
  • 产品类别:无线连接
  • 技术类目:其他无线技术
  • 功能描述:具有 EEPROM 和 134.2kHz 感应器接口的无源低频接口设备 (PaLFI)
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TMS37157的产品详情:

The TMS37157 combines a Low Frequency Transponder Interface with an SPI Interface and Power Management for a connected microcontroller. It is the ideal device for any Configuration, Data Logger-, Sensoror Remote Control Application. The Transponder memory is accessible through SPI and LF and, in the second case, operates without the need for a battery. The use of the Low Frequency Band ensures a communication in a defined direction and harsh environments.

The TMS37157 manages the Transponder communication and push button interaction. During sleep state the devices enters a special low power mode with only 60 nA current consumption.

The EEPROM memory is accessible over the LF interface without support from the battery or through SPI by a microcontroller if a battery is connected. The TMS37157 offers a special battery charge mode.

The external resonance circuit with a LF coil and a resonance capacitor can be trimmed to the correct resonance frequency with the integrated trimming capability achieving an easy way to eliminate part tolerances.

The small RSA 16-pin package together with only a few external components results in a cost efficient design.

TMS37157的优势和特性:
  • Wide Supply Voltage Range 2 V to 3.6 V
  • Ultra Low Power Consumption
    • Active Mode Max. 150 μA
    • Power Down Mode 60 nA
  • 121 Free Bytes User Memory
  • Low Frequency Halb Duplex (HDX) Interface
    • HDX Transponder Communication Achieving Maximum Perfomance and Highest Noise Immunity
    • Special Selective Addressing Mode Allows Anti Collision
    • Up to 8 kbit/s LF Uplink Data Rate
    • 126 Byte EEPROM:
      • 121 Bytes Free Available EEPROM User Memory
      • 32 Bit Unique Serial Number
      • 8 Bit Selective Address
      • High EEPROM Flexibility
      • Pages are Irreversible Lockable and Protectable
    • Battery Check and Battery Charge Function
    • Resonance Frequency: 134.2 kHz
    • Integrated Resonance Frequency Trimming
    • Downlink – Amplitude Shift Keying
    • Uplink – Frequency Shift Keying
  • 3 Wire SPI Interface for Accessing the EEPROM and Exchanging Data With the Microcontroller Through the LF Interface
  • 0.6mm Pitch, 4mm x 4mm VQFN Package
  • APPLICATIONS
    • Wireless Batteryless Sensor Interface using Energy Harvesting
      • Microcontroller and Sensor can be Powered Through the LF Link
      • Data is Directly Transmitted Over the LF Link From the Base Station via the TMS37157 to the Micrcontroller and Vice Versa.
    • Batteryless Configuration Memory
      • Memory can be Written Without Battery Support
      • Microcontroller can Read the Content of the Memory When It Gets Connected to a Battery and Use It for Configuration
      • Microcontroller can Write the Memory, Which can be Read Out Later Through the LF Link
    • Ultra Low Power Data Logger Memory (Smart Metering)
      • Memory Can Be Written By a Microcontroller
      • Memory Can Be Read Through LF Interface Without Battery Support
    • Multi Purpose LF Interface to a Microcontroller
      • Short Range RF Interface to a Microcontroller Where Other Frequencies are Not an Option
      • Ultra Low Power Mode can Result in an Overall Power Consumption of 60 nA
    • Remote Control Application
      • Combination With an UHF Transmitter or IR Transmitter and a μC
      • Power Management of the TMS37157 can Power Down the Microcontroller
      • The Push Button Detection Circuit can Power Up a Microcontroller
    • Stand Alone LF-Transponder with Memory
      • RFID Transponder with Unique ID and 121 Bytes Free Programmable EEPROM User Memory
      • Only Few Additional Components Needed
      • No Battery Required

TMS37157的参数(英文):
  • Frequency
  • 134.2 kHz
  • Standard
  • TI protocol
  • Operating temperature range (C)
  • -40 to 85
  • Rating
  • Automotive
  • Transmission principle
  • HDX - FSK
TMS37157具体的完整产品型号参数及价格(美元):

TMS37157的完整型号有:TMS37157IRSARG4,以下是这些产品的关键参数及官网采购报价:

TMS37157IRSARG4,工作温度:-40 to 85,封装:QFN (RSA)-16,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-2-260C-1 YEAR,引脚镀层/焊球材料:NIPDAU,TI官网TMS37157IRSARG4的批量USD价格:1.039(1000+)

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TMS37157的评估套件:

TMS37157IRSARG4,工作温度:-40 to 85,封装:QFN (RSA)-16,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-2-260C-1 YEAR,引脚镀层/焊球材料:NIPDAU,TI官网TMS37157IRSARG4的批量USD价格:1.039(1000+)

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