The TPA152 is a stereo audio power amplifier capable of less than 0.1% THD+N at 1 kHz when delivering 75 mW per channel into a 32- loads, the THD+N performance is better than 0.005% at 1 kHz, and less than 0.01% across the audio band of 20 to 20 kHz.

The TPA152 is ideal for use as an output buffer for the audio CODEC in PC systems. It is also excellent for use where a high-performance head phone/line-out amplifier is needed. Depop circuitry is integrated to reduce transients during power up, power down, and mute mode.

Amplifier gain is externally configured by means of two resistors per input channel and does not require external compensation for settings of 1 to 10. The TPA152 is packaged in the 8-pin SOIC (D) package that reduces board space and facilitates automated assembly.

• High-Fidelity Line-Out/HP Driver
• 75-mW Stereo Output
• PC Power Supply Compatible
• Pop Reduction Circuitry
• Internal Mid-Rail Generation
• Thermal and Short-Circuit Protection
• Surface-Mount Packaging
• Pin Compatible With TPA302

• Output power (W)
• 0.075
• Analog supply (Min) (V)
• 4.5
• Analog supply (Max) (V)
• 5.5
• PSRR (dB)
• 81
• Rating
• Catalog
• Operating temperature range (C)
• -40 to 85
• Headphone channels
• Stereo
• Volume control
• No
• Architecture
• Class-AB
• Iq per channel (Typ) (mA)
• 2.8

TPA152的完整型号有：TPA152D、TPA152DR，以下是这些产品的关键参数及官网采购报价：

TPA152D，工作温度：-40 to 85，封装：SOIC (D)-8，包装数量MPQ：75个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网TPA152D的批量USD价格：.932（1000+）

TPA152DR，工作温度：-40 to 85，封装：SOIC (D)-8，包装数量MPQ：2500个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网TPA152DR的批量USD价格：.777（1000+）

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