The TPA2005D1-Q1 device is a 1.4-W high-efficiency filter-free class-D audio power amplifier in a SON or MSOP-PowerPAD package that requires only three external components.

Features like 84% efficiency, –71-dB PSRR at 217 Hz, improved RF-rectification immunity, and 15-mm² total PCB area make TPA2005D1-Q1 ideal for low-power audio applications in infotainment and cluster.

The device allows for independent gain control by summing the signals from each function while minimizing noise to only 48 µV_RMS. Additionally, the TPA2005D1-Q1 device offers fast start-up time of 9 ms with minimal pop and has short circuit and thermal protection.

For all available packages, see the orderable addendum at the end of the data sheet.

• Qualified for Automotive Applications
• AEC-Q100 Qualified With the Following Results:
  • Device Temperature Grade 3 (DRB and DGN package non T-suffix): –40°C to +85°C Ambient Operating Temperature Range
  • Device Temperature Grade 2 (DGN package T-suffix): –40°C to +105°C Ambient Operating Temperature Range
  • Device HBM Classification Level 2
  • Device CDM Classification Level C5
• 1.4 W Into 8 ? From a 5-V Supply at THD = 10% (Typical)
• Maximum Battery Life and Minimum Heat
  • Efficiency With an 8-? Speaker:
    • 84% at 400 mW
    • 79% at 100 mW
  • 2.8-mA Quiescent Current
  • 0.5-μA Shutdown Current
• Only Three External Components
  • Optimized PWM Output Stage Eliminates LC Output Filter
  • Internally Generated 250-kHz Switching Frequency Eliminates Capacitor and Resistor
  • Improved PSRR (–71 dB at 217 Hz) and Wide Supply Voltage (2.5 V to 5.5 V) Eliminates Need for a Voltage Regulator
  • Fully Differential Design Reduces RF Rectification and Eliminates Bypass Capacitor
  • Improved CMRR Eliminates Two Input Coupling Capacitors
• Space-Saving Packages
  • 3 mm × 3 mm SON package (DRB)
  • 3 mm × 5 mm MSOP-PowerPAD Package (DGN)

All trademarks are the property of their respective owners.

• Audio input type
• Analog Input
• Architecture
• Class-D
• Speaker channels (Max)
• Mono
• Power stage supply (Max) (V)
• 5.5
• Power stage supply (Min) (V)
• 4.4
• Load (Min) (ohms)
• 8
• Output power (W)
• 1.18
• SNR (dB)
• 97
• THD + N @ 1 kHz (%)
• 0.2
• Iq (Typ) (mA)
• 2.8
• Control interface
• Hardware
• Closed/open loop
• Open
• Analog supply (Min) (V)
• 4.5
• Analog supply (Max) (V)
• 5.5
• PSRR (dB)
• 75
• Operating temperature range (C)
• -40 to 105, -40 to 85

TPA2005D1-Q1的完整型号有：TPA2005D1DGNRQ1、TPA2005D1DRBQ1、TPA2005D1TDGNRQ1，以下是这些产品的关键参数及官网采购报价：

TPA2005D1DGNRQ1，工作温度：-40 to 85，封装：HVSSOP (DGN)-8，包装数量MPQ：2500个，MSL 等级/回流焊峰值温度：Level-2-260C-1 YEAR，引脚镀层/焊球材料：NIPDAUAG，TI官网TPA2005D1DGNRQ1的批量USD价格：.532（1000+）

TPA2005D1DRBQ1，工作温度：-40 to 85，封装：SON (DRB)-8，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-2-260C-1 YEAR，引脚镀层/焊球材料：NIPDAU，TI官网TPA2005D1DRBQ1的批量USD价格：.532（1000+）

TPA2005D1TDGNRQ1，工作温度：-40 to 105，封装：HVSSOP (DGN)-8，包装数量MPQ：2500个，MSL 等级/回流焊峰值温度：Level-2-260C-1 YEAR，引脚镀层/焊球材料：NIPDAUAG，TI官网TPA2005D1TDGNRQ1的批量USD价格：.532（1000+）

PSPICE-FOR-TI — 适用于 TI 设计和模拟工具的 PSpice

PSpice for TI 可提供帮助评估模拟电路功能的设计和仿真环境。此功能齐全的设计和仿真套件使用 Cadence 的模拟分析引擎。PSpice for TI 可免费使用，包括业内超大的模型库之一，涵盖我们的模拟和电源产品系列以及精选的模拟行为模型。

借助?PSpice for TI 的设计和仿真环境及其内置的模型库，您可对复杂的混合信号设计进行仿真。创建完整的终端设备设计和原型解决方案，然后再进行布局和制造，可缩短产品上市时间并降低开发成本。

在?PSpice for TI 设计和仿真工具中，您可以搜索 TI (...)