- 制造厂商：TI
- 产品类别：音频
- 技术类目：音频放大器 - 扬声器放大器
- 功能描述：具有直流音量控制和立体声耳机驱动器的 2W、立体声、AB 类音频放大器
- 点击这里打开及下载TPA6021A4的技术文档资料
- TI代理渠道，提供当日发货、严格的质量标准，满足您的目标价格
The TPA6021A4 is a stereo audio power amplifier that drives 2 W/channel of continuous RMS power into a 4-
load when utilizing a heat sink. Advanced dc volume control minimizes external components and allows BTL (speaker) volume control and SE (headphone) volume control.
The 20-pin DIP package allows for the use of a heatsink which provides higher output power.
To ensure a smooth transition between active and shutdown modes, a fade mode ramps the volume up and down.
- 2 W Into 4- Speakers With External Heatsink
- DC Volume Control With 2-dBSteps from -40 dB to 20 dB
- Fade Mode
- -85-dB Mute Mode
- Differential Inputs
- 1-μA Shutdown Current (Typical)
- Headphone Mode
- APPLICATIONS
- LCD Monitors
- Audio input type
- Analog Input
- Architecture
- Class-AB
- Speaker channels (Max)
- Stereo
- Power stage supply (Max) (V)
- 5.5
- Power stage supply (Min) (V)
- 4
- Load (Min) (ohms)
- 4
- Output power (W)
- 2
- THD + N @ 1 kHz (%)
- 0.8
- Iq (Typ) (mA)
- 5
- Control interface
- Hardware
- Closed/open loop
- Open
- Analog supply (Min) (V)
- 4
- Analog supply (Max) (V)
- 5.5
- PSRR (dB)
- 70
- Operating temperature range (C)
- -40 to 85
TPA6021A4的完整型号有：TPA6021A4N，以下是这些产品的关键参数及官网采购报价：
TPA6021A4N，工作温度：-40 to 85，封装：PDIP (N)-20，包装数量MPQ：20个，MSL 等级/回流焊峰值温度：N/A for Pkg Type，引脚镀层/焊球材料：NIPDAU，TI官网TPA6021A4N的批量USD价格：1.626（1000+）
TPA6021A4EVM — TPA6021A4 评估模块 (EVM)
The TPA6021A4 is a stereo audio power amplifier that drives 2 W/channel of continuous RMS power into a 4- load when utilizing a heat sink. Advanced dc volume control minimizes external components and allows BTL (speaker) volume control and SE (headphone) volume control.
The 20-pin DIP package (...)
PSPICE-FOR-TI — 适用于 TI 设计和模拟工具的 PSpice
PSpice for TI 可提供帮助评估模拟电路功能的设计和仿真环境。此功能齐全的设计和仿真套件使用 Cadence 的模拟分析引擎。PSpice for TI 可免费使用，包括业内超大的模型库之一，涵盖我们的模拟和电源产品系列以及精选的模拟行为模型。借助?PSpice for TI 的设计和仿真环境及其内置的模型库，您可对复杂的混合信号设计进行仿真。创建完整的终端设备设计和原型解决方案，然后再进行布局和制造，可缩短产品上市时间并降低开发成本。
在?PSpice for TI 设计和仿真工具中，您可以搜索 TI (...)
