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TPA6111A2的基本参数
  • 制造厂商:TI
  • 产品类别:音频
  • 技术类目:音频放大器 - 耳机放大器
  • 功能描述:150mW 立体声模拟输入耳机放大器
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TPA6111A2的产品详情:

The TPA6111A2 is a stereo audio power amplifier packaged in either an 8-pin SOIC or an 8-pin PowerPAD MSOP package capable of delivering 150 mW of continuous RMS power per channel into 16-Ω loads. Amplifier gain is externally configured by means of two resistors per input channel and does not require external compensation for settings of 0 to 20 dB.

THD+N, when driving a 16-Ω load from 5 V, is 0.03% at 1 kHz, and less than 1% across the audio band of 20?Hz to 20 kHz. For 32-Ω loads, the THD+N is reduced to less than 0.02% at 1 kHz, and is less than 1% across the audio band of 20 Hz to 20 kHz. For 10-kΩ loads, the THD+N performance is 0.005% at 1 kHz, and less than 0.5% across the audio band of 20 Hz to 20 kHz.

TPA6111A2的优势和特性:
  • 150-mW Stereo Output
  • PC Power Supply Compatible
    • Fully Specified for 3.3-V and 5-V Operation
    • Operation to 2.5 V
  • Pop Reduction Circuitry
  • Internal Midrail Generation
  • Thermal and Short-Circuit Protection
  • Surface-Mount Packaging
    • PowerPAD? MSOP
    • SOIC
  • Pin Compatible With TPA122, LM4880, and LM4881 (SOIC)
TPA6111A2的参数(英文):
  • Output power (W)
  • 0.15
  • Analog supply (Min) (V)
  • 2.5
  • Analog supply (Max) (V)
  • 5.5
  • PSRR (dB)
  • 83
  • Rating
  • Catalog
  • Operating temperature range (C)
  • -40 to 85
  • Headphone channels
  • Stereo
  • Volume control
  • No
  • Shutdown current (ISD) (uA)
  • 1
  • Architecture
  • Class-AB
  • Iq per channel (Typ) (mA)
  • 0.75
TPA6111A2具体的完整产品型号参数及价格(美元):

TPA6111A2的完整型号有:TPA6111A2D、TPA6111A2DGN、TPA6111A2DGNR、TPA6111A2DR,以下是这些产品的关键参数及官网采购报价:

TPA6111A2D,工作温度:-40 to 85,封装:SOIC (D)-8,包装数量MPQ:75个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网TPA6111A2D的批量USD价格:0.434(1000+)

TPA6111A2DGN,工作温度:-40 to 85,封装:HVSSOP (DGN)-8,包装数量MPQ:80个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAUAG,TI官网TPA6111A2DGN的批量USD价格:0.534(1000+)

TPA6111A2DGNR,工作温度:-40 to 85,封装:HVSSOP (DGN)-8,包装数量MPQ:2500个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网TPA6111A2DGNR的批量USD价格:0.462(1000+)

TPA6111A2DR,工作温度:-40 to 85,封装:SOIC (D)-8,包装数量MPQ:2500个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网TPA6111A2DR的批量USD价格:0.362(1000+)

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TPA6111A2的评估套件:

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