The TPA721 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA721 can deliver 250-mW of continuous power into a BTL 8- load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation is optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a supply current of 7 µA during shutdown. The TPA721 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.

• Fully Specified for 3.3-V and 5-V Operation
• Wide Power Supply Compatibility 2.5 V – 5.5 V
• Output Power for RL = 8
  • 700 mW at VDD = 5 V, BTL
  • 250 mW at VDD = 3.3 V, BTL
• Integrated Depop Circuitry
• Thermal and Short-Circuit Protection
• Surface-Mount Packaging
  • SOIC
  • PowerPAD? MSOP

PowerPAD is a trademark of Texas Instruments.

• Audio input type
• Analog Input
• Architecture
• Class-AB
• Speaker channels (Max)
• Mono
• Power stage supply (Max) (V)
• 5.5
• Power stage supply (Min) (V)
• 2.5
• Load (Min) (ohms)
• 8
• Output power (W)
• 0.7
• THD + N @ 1 kHz (%)
• 0.5
• Iq (Typ) (mA)
• 1.25
• Control interface
• Hardware
• Closed/open loop
• Closed
• Analog supply (Min) (V)
• 2.5
• Analog supply (Max) (V)
• 5.5
• PSRR (dB)
• 85
• Operating temperature range (C)
• -40 to 85

TPA721的完整型号有：TPA721D、TPA721DGN、TPA721DGNR、TPA721DR，以下是这些产品的关键参数及官网采购报价：

TPA721D，工作温度：PropertyValue，封装：SOIC (D)-8，包装数量MPQ：75个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网TPA721D的批量USD价格：.484（1000+）

TPA721DGN，工作温度：PropertyValue，封装：HVSSOP (DGN)-8，包装数量MPQ：80个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网TPA721DGN的批量USD价格：.584（1000+）

TPA721DGNR，工作温度：-40 to 85，封装：HVSSOP (DGN)-8，包装数量MPQ：2500个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网TPA721DGNR的批量USD价格：.504（1000+）

TPA721DR，工作温度：PropertyValue，封装：SOIC (D)-8，包装数量MPQ：2500个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网TPA721DR的批量USD价格：.404（1000+）

TPA721 TINA-TI Reference Design

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