The TPA751 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA751 can deliver 250-mW of continuous power into a BTL 8- load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation is optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown. The TPA751 is available in a 3.0 × 3.0 mm MicroStar Junior™ (BGA), 8-pin SOIC surface-mount package and a surface-mount PowerPAD™ MSOP.

• Fully Specified for 3.3-V and 5-V Operation
• Wide Power Supply Compatibility 2.5 V – 5.5 V
• Power Supply Rejection at 217 Hz
  • 84 dB at VDD = 5 V
  • 81 dB at VDD = 3.3 V
• Output Power for RL = 8
  • 700 mW at VDD = 5 V
  • 250 mW at VDD = 3.3 V
• Ultralow Supply Current in Shutdown Mode . . . 1.5 nA
• Thermal and Short-Circuit Protection
• Surface-Mount Packaging
  • SOIC
  • PowerPAD? MSOP
  • MicroStar Junior? (BGA)

PowerPAD and MicroStar Junior are trademarks of Texas Instruments.

• Audio input type
• Analog Input
• Architecture
• Class-AB
• Speaker channels (Max)
• Mono
• Power stage supply (Max) (V)
• 5.5
• Power stage supply (Min) (V)
• 2.5
• Load (Min) (ohms)
• 8
• Output power (W)
• 0.7
• THD + N @ 1 kHz (%)
• 0.5
• Iq (Typ) (mA)
• 1.45
• Control interface
• Hardware
• Closed/open loop
• Closed
• Analog supply (Min) (V)
• 2.5
• Analog supply (Max) (V)
• 5.5
• PSRR (dB)
• 85
• Operating temperature range (C)
• -40 to 85

TPA751的完整型号有：TPA751D、TPA751DGN、TPA751DGNR、TPA751DR，以下是这些产品的关键参数及官网采购报价：

TPA751D，工作温度：-40 to 85，封装：SOIC (D)-8，包装数量MPQ：75个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网TPA751D的批量USD价格：.741（1000+）

TPA751DGN，工作温度：-40 to 85，封装：HVSSOP (DGN)-8，包装数量MPQ：80个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网TPA751DGN的批量USD价格：.841（1000+）

TPA751DGNR，工作温度：-40 to 85，封装：HVSSOP (DGN)-8，包装数量MPQ：2500个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网TPA751DGNR的批量USD价格：.717（1000+）

TPA751DR，工作温度：-40 to 85，封装：SOIC (D)-8，包装数量MPQ：2500个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网TPA751DR的批量USD价格：.617（1000+）

TPA751EVM — TPA751 评估模块 (EVM)

A 700-mW bridge-tied load (BTL) mono amplifier with ultra-low supply current, active low shutdown current (ISD = 1.5 nA) and differential inputs. The TPA751 is characterized at 3.3 V and 5 V.

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