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TS5V330的基本参数
  • 制造厂商:TI
  • 产品类别:开关与多路复用器
  • 技术类目:特定于协议的开关和多路复用器
  • 功能描述:5V、2:1 (SPDT)、4 通道视频开关
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TS5V330的产品详情:

The TS5V330 video switch is a 4-bit 1-of-2 multiplexer/demultiplexer with a single switch-enable (EN) input. When EN is low, the switch is enabled and the D port is connected to the S port. When EN is high, the switch is disabled and the high-impedance state exists between the D and S ports. The select (IN) input controls the data path of the multiplexer/demultiplexer.

Low differential gain and phase make this switch ideal for composite and RGB video applications. This device has wide bandwidth and low crosstalk, making it suitable for high-frequency applications as well.

This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. This switch maintains isolation during power off.

To ensure the high-impedance state during power up or power down, EN should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

TS5V330的优势和特性:
  • Low Differential Gain and Phase (DG = 0.64%, DP = 0.1 Degrees Typ)
  • Wide Bandwidth (BW = 300 MHz Min)
  • Low Crosstalk (XTALK = –63 dB Typ)
  • Low Power Consumption (ICC = 3 μA Max)
  • Bidirectional Data Flow With Near-Zero Propagation Delay
  • Low ON-State Resistance (ron = 3 Typ)
  • VCC Operating Range From 4.5 V to 5.5 V
  • Ioff Supports Partial-Power-Down Mode Operation
  • Data and Control Inputs Provide Undershoot Clamp Diode
  • Control Inputs Can Be Driven by TTL or 5-V/3.3-V CMOS Outputs
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 1000-V Charged-Device Model (C101)
  • Suitable for Both RGB and Composite-Video Switching

TS5V330的参数(英文):
  • Protocols
  • RGB, Composite
  • Configuration
  • 2:1 SPDT
  • Number of channels (#)
  • 4
  • Bandwidth (MHz)
  • 300
  • Supply voltage (Max) (V)
  • 5.5
  • Supply voltage (Min) (V)
  • 4
  • Ron (Typ) (Ohms)
  • 3
  • Input/ouput voltage (Min) (V)
  • 0
  • Input/ouput voltage (Max) (V)
  • 5.5
  • Supply current (Typ) (uA)
  • 3
  • Operating temperature range (C)
  • -40 to 85
  • Crosstalk (dB)
  • -63
  • ESD CDM (kV)
  • 1
  • ICC (Typ) (uA)
  • 3
  • Input/output continuous current (Max) (mA)
  • 128
  • COFF (Typ) (pF)
  • 4
  • CON (Typ) (pF)
  • 14
  • Off isolation (Typ) (dB)
  • -60
  • OFF-state leakage current (Max) (μA)
  • 1
  • Propagation delay (ns)
  • 6
  • Ron (Max) (Ohms)
  • 10
  • Turn off time (disable) (Max) (ns)
  • 6
  • Turn on time (enable) (Max) (ns)
  • 6
  • VIH (Min) (V)
  • 2
  • VIL (Max) (V)
  • 0.8
TS5V330具体的完整产品型号参数及价格(美元):

TS5V330的完整型号有:TS5V330D、TS5V330DBQR、TS5V330DR、TS5V330PW、TS5V330PWR、TS5V330RGYR,以下是这些产品的关键参数及官网采购报价:

TS5V330D,工作温度:-40 to 85,封装:SOIC (D)-16,包装数量MPQ:40个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网TS5V330D的批量USD价格:0.443(1000+)

TS5V330DBQR,工作温度:-40 to 85,封装:SSOP (DBQ)-16,包装数量MPQ:2500个,MSL 等级/回流焊峰值温度:Level-2-260C-1 YEAR,引脚镀层/焊球材料:NIPDAU,TI官网TS5V330DBQR的批量USD价格:0.369(1000+)

TS5V330DR,工作温度:-40 to 85,封装:SOIC (D)-16,包装数量MPQ:2500个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网TS5V330DR的批量USD价格:0.369(1000+)

TS5V330PW,工作温度:-40 to 85,封装:TSSOP (PW)-16,包装数量MPQ:90个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网TS5V330PW的批量USD价格:0.443(1000+)

TS5V330PWR,工作温度:-40 to 85,封装:TSSOP (PW)-16,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网TS5V330PWR的批量USD价格:0.264(1000+)

TS5V330RGYR,工作温度:-40 to 85,封装:VQFN (RGY)-16,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-2-260C-1 YEAR,引脚镀层/焊球材料:NIPDAU,TI官网TS5V330RGYR的批量USD价格:0.369(1000+)

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TS5V330的评估套件:

LEADED-ADAPTER1 — 用于快速测试 TI 5、8、10、16 和 24 引脚引线式封装的表面贴装转 DIP 接头适配器

EVM-LEADED1 板可对 TI 的常见引线式封装进行快速测试和电路板试验。该评估板具有足够的空间,可将 TI 的 D、DBQ、DCT、DCU、DDF、DGS、DGV 和 PW 表面贴装封装转换为 100mil DIP 接头。

LEADLESS-ADAPTER1 — 用于测试 TI 6、8、10、12、14、16 和 20 引脚无引线封装的表面贴装转 DIP 接头适配器

EVM-LEADLESS1 板可对 TI 的常见引线式封装进行快速测试和电路板试验。该评估板具有足够的空间,可将 TI 的 DRC、DTP、DQE、RBW、RGY、RSE、RSV、RSW、RTE、RTJ、RUK、RUC、RUG、RUM、RUT 和 YZP 表面贴装封装转换为 100mil DIP 接头。
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