The UCC2732x/UCC3732x family of high-speed drivers deliver 9 A of peak drive current in an industry standard pinout. These drivers can drive the largest of MOSFETs for systems requiring extreme Miller current due to high dV/dt transitions. This eliminates additional external circuits and can replace multiple components to reduce space, design complexity, and assembly cost. Two standard logic options are offered, inverting (UCC37321) and noninverting (UCC37322).

Using a design that inherently minimizes shoot-through current, the outputs of these can provide high gate drive current where it is most needed at theMiller plateau region during the MOSFET switching transition. A unique hybrid output stage paralleling bipolar and MOSFET transistors (TrueDrive) allows efficient current delivery at low supply voltages. With this drive architecture, UCC3732x can be used in industry standard 6-A, 9-A and many 12-A driver applications. Latch up and ESD protection circuitries are also included. Finally, the UCC3732x provides an enable (ENBL) function to have better control of the operation of the driver applications. ENBL is implemented on pin 3, which was previously left unused in the industry standard pinout. It is internally pulled up to V_DD for active high logic and can be left open for standard operation.

In addition to the 8-pin SOIC (D) and 8-pin PDIP (P) package offerings, the UCC3732x also comes in the thermally enhanced but tiny 8-pin MSOP PowerPAD™ (DGN) package. The PowerPAD package drastically lowers the thermal resistance to extend the temperature operation range and improve the long-term reliability.

• Industry-Standard Pin-Out With Addition of Enable Function
• High-Peak Current Drive Capability of ±9 A at theMiller plateau region Using TrueDrive
• Efficient Constant Current Sourcing Using a Unique BiPolar and CMOS Output Stage
• TTL/CMOS Compatible Inputs Independent of Supply Voltage
• 20-ns Typical Rise and Fall Times With 10-nF Load
• Typical Propagation Delay Times of 25 ns With Input Falling and 35 ns With Input Rising
• 4-V to 15-V Supply Voltage
• Available in Thermally Enhanced MSOP PowerPAD? Package With 4.7°C/W θjc
• Rated From –40°C to +105°C
• Pb-Free Finish (CU NIPDAU) on 8-pin SOIC and PDIP Packages

• Number of channels (#)
• 1
• Power switch
• MOSFET, IGBT
• Peak output current (A)
• 9
• Input VCC (Min) (V)
• 4
• Input VCC (Max) (V)
• 15
• Features
• Enable Pin
• Operating temperature range (C)
• -40 to 105
• Rise time (ns)
• 20
• Fall time (ns)
• 20
• Prop delay (ns)
• 25
• Input threshold
• CMOS, TTL
• Channel input logic
• Inverting
• Input negative voltage (V)
• 0
• Rating
• Catalog
• Driver configuration
• Single

UCC27321的完整型号有：UCC27321D、UCC27321DGN、UCC27321DGNR、UCC27321DR、UCC27321P，以下是这些产品的关键参数及官网采购报价：

UCC27321D，工作温度：-40 to 105，封装：SOIC (D)-8，包装数量MPQ：75个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网UCC27321D的批量USD价格：.528（1000+）

UCC27321DGN，工作温度：-40 to 105，封装：HVSSOP (DGN)-8，包装数量MPQ：80个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAUAG，TI官网UCC27321DGN的批量USD价格：.528（1000+）

UCC27321DGNR，工作温度：-40 to 105，封装：HVSSOP (DGN)-8，包装数量MPQ：2500个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAUAG，TI官网UCC27321DGNR的批量USD价格：.44（1000+）

UCC27321DR，工作温度：-40 to 105，封装：SOIC (D)-8，包装数量MPQ：2500个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：Call TI，TI官网UCC27321DR的批量USD价格：.44（1000+）

UCC27321P，工作温度：-40 to 105，封装：PDIP (P)-8，包装数量MPQ：50个，MSL 等级/回流焊峰值温度：N/A for Pkg Type，引脚镀层/焊球材料：NIPDAU，TI官网UCC27321P的批量USD价格：.594（1000+）

UCC27321 PSpice Transient Model

PSpice for TI 可提供帮助评估模拟电路功能的设计和仿真环境。此功能齐全的设计和仿真套件使用 Cadence 的模拟分析引擎。PSpice for TI 可免费使用，包括业内超大的模型库之一，涵盖我们的模拟和电源产品系列以及精选的模拟行为模型。

借助?PSpice for TI 的设计和仿真环境及其内置的模型库，您可对复杂的混合信号设计进行仿真。创建完整的终端设备设计和原型解决方案，然后再进行布局和制造，可缩短产品上市时间并降低开发成本。

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UCC2732X Schematic Review Template

光探测和测距 (LIDAR) 系统利用光在物体之间传输所需的时间尝试测量与此目标之间的距离。TIDA-00663 参考设计展示了如何为 LIDAR 设计基于时间数字转换器 (TDC) 的时间测量后端以及相关的前端。LIDAR 脉冲飞行时间参考设计可用于无法通过建立与目标的实际接触来测量与目标之间的距离的所有应用。典型示例包括测量后勤中心的传送带上是否存在物体、在众多机械手之中确保运动的机械手周围保持安全距离。