The UCC2732x/UCC3732x family of high-speed drivers deliver 9 A of peak drive current in an industry standard pinout. These drivers can drive the largest of MOSFETs for systems requiring extreme Miller current due to high dV/dt transitions. This eliminates additional external circuits and can replace multiple components to reduce space, design complexity, and assembly cost. Two standard logic options are offered, inverting (UCC37321) and noninverting (UCC37322).

Using a design that inherently minimizes shoot-through current, the outputs of these can provide high gate drive current where it is most needed at theMiller plateau region during the MOSFET switching transition. A unique hybrid output stage paralleling bipolar and MOSFET transistors (TrueDrive) allows efficient current delivery at low supply voltages. With this drive architecture, UCC3732x can be used in industry standard 6-A, 9-A and many 12-A driver applications. Latch up and ESD protection circuitries are also included. Finally, the UCC3732x provides an enable (ENBL) function to have better control of the operation of the driver applications. ENBL is implemented on pin 3, which was previously left unused in the industry standard pinout. It is internally pulled up to V_DD for active high logic and can be left open for standard operation.

In addition to the 8-pin SOIC (D) and 8-pin PDIP (P) package offerings, the UCC3732x also comes in the thermally enhanced but tiny 8-pin MSOP PowerPAD™ (DGN) package. The PowerPAD package drastically lowers the thermal resistance to extend the temperature operation range and improve the long-term reliability.

• Industry-Standard Pin-Out With Addition of Enable Function
• High-Peak Current Drive Capability of ±9 A at theMiller plateau region Using TrueDrive
• Efficient Constant Current Sourcing Using a Unique BiPolar and CMOS Output Stage
• TTL/CMOS Compatible Inputs Independent of Supply Voltage
• 20-ns Typical Rise and Fall Times With 10-nF Load
• Typical Propagation Delay Times of 25 ns With Input Falling and 35 ns With Input Rising
• 4-V to 15-V Supply Voltage
• Available in Thermally Enhanced MSOP PowerPAD? Package With 4.7°C/W θjc
• Rated From –40°C to +105°C
• Pb-Free Finish (CU NIPDAU) on 8-pin SOIC and PDIP Packages

• Number of channels (#)
• 1
• Power switch
• MOSFET, IGBT
• Peak output current (A)
• 9
• Input VCC (Min) (V)
• 4
• Input VCC (Max) (V)
• 15
• Features
• Enable Pin
• Operating temperature range (C)
• -40 to 105
• Rise time (ns)
• 20
• Fall time (ns)
• 20
• Prop delay (ns)
• 25
• Input threshold
• CMOS, TTL
• Channel input logic
• Non-Inverting
• Input negative voltage (V)
• 0
• Rating
• Catalog
• Driver configuration
• Single

UCC27322的完整型号有：UCC27322D、UCC27322DGN、UCC27322DGNR、UCC27322DR、UCC27322P，以下是这些产品的关键参数及官网采购报价：

UCC27322D，工作温度：-40 to 105，封装：SOIC (D)-8，包装数量MPQ：75个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网UCC27322D的批量USD价格：.528（1000+）

UCC27322DGN，工作温度：-40 to 105，封装：HVSSOP (DGN)-8，包装数量MPQ：80个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAUAG，TI官网UCC27322DGN的批量USD价格：.528（1000+）

UCC27322DGNR，工作温度：-40 to 105，封装：HVSSOP (DGN)-8，包装数量MPQ：2500个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAUAG，TI官网UCC27322DGNR的批量USD价格：.44（1000+）

UCC27322DR，工作温度：-40 to 105，封装：SOIC (D)-8，包装数量MPQ：2500个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：Call TI，TI官网UCC27322DR的批量USD价格：.44（1000+）

UCC27322P，工作温度：-40 to 105，封装：PDIP (P)-8，包装数量MPQ：50个，MSL 等级/回流焊峰值温度：N/A for Pkg Type，引脚镀层/焊球材料：NIPDAU，TI官网UCC27322P的批量USD价格：.594（1000+）

UCC27322 PSpice Transient Model

PSpice for TI 可提供帮助评估模拟电路功能的设计和仿真环境。此功能齐全的设计和仿真套件使用 Cadence 的模拟分析引擎。PSpice for TI 可免费使用，包括业内超大的模型库之一，涵盖我们的模拟和电源产品系列以及精选的模拟行为模型。

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